2026 highlights

Day 1: A busy day of networking, learning and business

ECOC Exhibition 2026 is well underway in Málaga, with a busy and vibrant exhibition hall as visitors make their way around more than 340 exhibiting companies, catching up with colleagues, exploring new technologies and discovering the latest developments across the optical communications industry. The show floor has been buzzing from the moment the doors opened, with stands busy, meetings underway and plenty of conversations taking place around the technologies shaping the next generation of networks.

The Market Focus theatre has also been standing room only this morning, with the opening sessions focusing firmly on the technologies needed to scale AI infrastructure. Discussions have covered scale-up and scale-out networking, optical circuit switching, the adoption of co-packaged optics (CPO), NPO versus CPO, components for 1600G+ and the role of advanced cooling in improving data-centre efficiency. The morning has also explored how optical connectivity needs to evolve to support increasingly demanding AI workloads, including contributions from Acacia, Cignal AI, Ciena, Huawei, Nokia, Coherent, Corning and Meta.

Over in the Product Focus theatre, the morning has showcased a diverse range of new technologies and product developments. Highlights have included CommScope’s FastSelfClean™ connector technology for high-density AI connectivity, Huawei’s approach to Ethernet for AI data centres, Taara’s integrated optical phased arrays for wireless optical communication, and sessions from Nokia and Marvell exploring optical components, NPO and the future of intra-data-centre connectivity.

From the latest developments in AI and data centre connectivity, high-speed optical technologies, CPO and NPO, photonic integration and next-generation networks, the exhibition floor was full of new products, technologies and ideas.

AI and the future of optical connectivity

AI infrastructure was one of the major themes running throughout Day 1, with Market Focus sessions exploring how optical technologies are evolving to meet the growing demands for bandwidth, scalability, density and efficiency.

Discussions explored the evolution of optical interconnects, the role of CPO and NPO, 1.6T connectivity and the technologies that could help support the next generation of AI data centres.

Innovation across the exhibition floor

With hundreds of exhibitors showcasing their latest technologies, there was plenty to discover across the show floor.

From optical components and photonic integrated circuits to fibre, transceivers, testing and measurement and advanced manufacturing, Day 1 demonstrated the breadth of innovation across the optical communications ecosystem.

Don’t forget to visit the Innovation Pod to meet companies exhibiting at ECOC for the first time and discover some of the emerging technologies and ideas entering the market.

Celebrating optical communications innovation

Day 1 also saw the ECOC Exhibition Industry Awards celebrate some of the most exciting innovations from across the industry.

Congratulations to all of this year’s nominees and winners!

View the 2026 Industry Award Winners →

Industry Announcements

There has also been plenty of activity and new technology announcements across the exhibition floor. LIGENTEC is celebrating 10 years of photonic integrated circuit innovation while unveiling new TFLN and integrated III-V photodetector platforms; DiCon Fiberoptics is showcasing a new optical power meter system for CPO and silicon photonics testing; Avicena is presenting its 1Tbps LightBundle™ evaluation kit; and Accelink is demonstrating a high-density, low-power XPO solution delivering 12.8Tbps. Meanwhile, Alcyon Photonics and EXFO are showcasing live photonic chip testing — giving visitors plenty of reasons to explore the stands and see the latest technologies first-hand.

What you missed at Market Focus on Day 1

Day one of Market Focus put the spotlight firmly on the technologies needed to scale optical connectivity for the AI era.

The morning programme explored scale-up and scale-out networking, optical circuit switching, CPO and NPO, 1600G+ components, advanced cooling and AI interconnects, with speakers from companies including Acacia, Cignal AI, Ciena, Huawei, Nokia, Coherent, Corning and Meta.

The afternoon continued with a deep dive into optical interconnect evolution, AI deployments, NVIDIA Spectrum-X, next-generation fibre, near-packaged optics and connectivity beyond 1.6T, before closing with a panel discussion on XPO and system scaling.

Monday at Market Focus

Day one of Market Focus set the tone for the week with a strong focus on scaling optical connectivity for AI infrastructure. The morning programme explored scale-across and scale-out networking, optical circuit switching, CPO and NPO, components for 1600G+ and the role of advanced cooling and optical connectivity in supporting the rapid growth of AI data centres. Discussions also looked at the physical infrastructure needed to scale backbone networks for the AI era.

The afternoon continued with the evolution of optical interconnects and AI-scale networking, examining the move from pluggable optics towards XPO and CPO, lessons from large-scale AI deployments, NVIDIA Spectrum-X architectures and the role of NPO in future AI infrastructure. Sessions also explored next-generation fibre, coherent-lite optics beyond 1.6T and the impact of AI demand and geopolitics on the optical component supply chain. The day concluded with a panel on XPO and System Scaling, bringing together system and module perspectives on the challenges of deploying next-generation optical connectivity at scale.

Day one of Product Focus showcased a broad range of new technologies and product developments for AI connectivity and next-generation optical networks. The programme opened with CommScope’s FastSelfClean™ connector technology for high-density AI data-centre connectivity, followed by sessions exploring DWDM laser-source architectures, Ethernet for AI data centres and the latest optical components for intra-data-centre connectivity. The morning also examined Near-Packaged Optics and the role of different optical architectures in meeting the demands of AI scale-up.

The afternoon turned towards manufacturing, access networks and the deployment of next-generation optical technologies, including scalable TFLN manufacturing, AI use cases in broadband access, technical insights into NPO and real-world comparisons between pluggable and embedded optics. The programme culminated in the ECOC Exhibition Industry Awards ceremony, where this year’s winners were announced live in the Product Focus theatre, celebrating innovation across the optical communications industry.

Highlights from Day 2

Day two at ECOC Exhibition 2026 has been another busy one at FYCMA in Málaga, with the exhibition floor buzzing with visitors, meetings and conversations throughout the day. With more than 340 exhibitors showcasing the latest technologies and solutions, there has been plenty to explore – from high-speed optical connectivity and photonic integration to data-centre infrastructure, testing, manufacturing and next-generation network technologies.

AI infrastructure and the challenge of scaling optical connectivity have been major themes across the show today. The Market Focus programme examined everything from the technologies enabling scale-up, scale-out and scale-across AI infrastructure to the future beyond 1.6T, CPO and NPO, photonics packaging and silicon photonics. The afternoon continued with discussions around optical architectures for next-generation Ethernet switches, 224G copper and optical interconnects, high-density low-power connectivity and next-generation pluggable optics, culminating in a panel looking at realistic approaches to AI interconnect scaling in the post-1.6T era.

Product Focus provided another packed programme, with sessions exploring the practical technologies needed to turn photonics innovation into scalable products. Topics included automated E-PIC and silicon photonics testing for high-volume manufacturing, Nokia’s Open XR Forum, optical route protection, quantum-safe transport, optical circuit switching and the latest developments in photonic technologies. The programme also looked ahead to open all-photonic networks, NPO for CPO scale-up and PICs for quantum-secure communications.

There has also been plenty of innovation to discover across the exhibitor stands. LIGENTEC is celebrating 10 years of PIC innovation while unveiling new TFLN and integrated III-V photodetector technology; DiCon Fiberoptics is showcasing its new Optical Power Meter System for high-volume CPO and silicon photonics testing; Avicena is presenting its 1Tbps LightBundle™ evaluation kit; and Accelink is demonstrating a high-density, low-power XPO solution delivering 12.8Tbps. Other highlights include live photonic chip testing from Alcyon Photonics and EXFO, Keysight’s 224G sampling scope for advanced multimode optical testing, and new developments in photonic packaging and fibre-array manufacturing.

Day two has also been a great opportunity to connect with the next generation of photonics talent, with the EPIC & ECOC Career Booth hosting companies, interviews and career conversations, alongside today’s guided booth tour for students and early-career professionals. As we head into the final day, there is still plenty to see and do – with the last Market Focus and Product Focus sessions, more exhibitor announcements and one final opportunity to explore the show floor before ECOC Exhibition 2026 closes at 16:00 on Wednesday.

 

Tuesday at Market Focus

Tuesday’s Market Focus programme put the spotlight firmly on scaling optical technologies for AI infrastructure, with the morning exploring the technologies enabling scale-up, scale-out and scale-across architectures. Sessions covered the transition towards the post-1.6T era, co-packaged optics, photonics packaging for high-volume manufacturing, silicon photonics and the growing importance of reliable, interoperable optical connectivity for AI data centres.

The afternoon moved into new and emerging technologies, examining the evolving role of photonics in AI and the architectures needed to support ever-greater bandwidth. Discussions covered optical architectures for next-generation Ethernet switches, 224G copper and optical interconnects, NPO for high-density optical interconnects, low-power connectivity standards and next-generation pluggable optics. The day concluded with a panel bringing together industry experts to assess the practical options for scaling AI interconnects in the post-1.6T era.

Tuesday’s Product Focus programme showcased technologies focused on turning photonics innovation into scalable, high-volume solutions. The morning explored automated E-PIC and silicon photonics testing, including the challenges of testing heterogeneous electro-photonic devices and developing future-proof, industry-standardised approaches for high-volume manufacturing. The programme also featured Nokia’s Open XR Forum, intelligent optical networking, quantum-safe transport and optical circuit switching for AI scale-up.

In the afternoon, the focus broadened to open photonic networks, NPO and quantum communications, with sessions examining open all-photonic networks, photonic integration and the role of PICs in quantum-secure communications. The programme highlighted how advances in photonic components, integration, testing and networking are coming together to support the next generation of AI infrastructure, data centres and secure communications.

Wednesday’s Market Focus programme turned its attention to networking, systems and service providers, exploring how optical networks are evolving to support the demands of AI. Sessions covered carrier-grade optical networks for distributed AI computing, satellite connectivity, 448Gbps signalling, AI optical interconnect standards and the future of coherent optics. The programme culminated in The Ethernet Evolution of AI panel, examining how Ethernet is developing as AI networks move towards higher speeds and greater scale.

The afternoon continued with a focus on the practical deployment of AI infrastructure, including carrier networks, optical interconnects, end-to-end connectivity for scale-up systems, hollow-core fibre, multi-data-centre compute and network sensing. Product Focus also provided a final showcase of innovation, with sessions covering photonic integration, PIC testing, 50G PON, open all-photonic networks and emerging technologies across the photonics ecosystem.

A major theme running throughout all three days has been the challenge – and opportunity – of building the optical infrastructure needed for the next generation of AI. Across Market Focus, Product Focus and the exhibition floor, conversations have centred on 1.6T and beyond, CPO and NPO, silicon photonics, advanced packaging, high-density interconnects, testing and manufacturing, alongside the wider evolution of optical networks. Live demonstrations, product announcements and new technologies showcased how the industry is responding to these demands.

Market Focus on Wednesday

The final day of Market Focus brings the focus firmly to networking, systems and service providers, exploring how optical networks are evolving to support the rapid growth of AI. The morning programme looks at carrier-grade optical networks for distributed AI, satellite connectivity, 448Gbps electrical signalling, AI optical interconnect standards and the future of coherent optics, before a panel on The Ethernet Evolution of AI examines the next generation of high-speed, high-radix networks.

The afternoon continues with the practical challenges of deploying AI infrastructure, including preparing carrier networks for AI, next-generation optical interconnects, end-to-end connectivity for scale-up systems and the deployment of hollow-core fibre. Sessions also explore opportunities for European service providers, optical reliability, multi-data-centre compute and network sensing — offering a broad look at how optical infrastructure is evolving beyond traditional connectivity.

Wednesday at Product Focus

Wednesday’s Product Focus programme showcases the latest developments across photonic integration, AI connectivity, optical networking and high-speed access. Highlights include EXFO’s PIC testing solutions, EPIC TechWatch featuring technologies from Albis Optoelectronics, LIGENTEC, Nanoscribe, iPronics, FEMTOprint and others, followed by sessions on 50G PON and the challenges of scaling PIC testing for high-volume production.

The afternoon continues with IOWN’s Open All-Photonic Network, automotive optical transceivers from KD and further developments in photonic technologies. With the exhibition closing at 16:00 today, Wednesday’s programme offers a final opportunity to catch the latest innovations, hear directly from technology leaders and explore the products and solutions being showcased across the exhibition floor.

 

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