Monday 2nd October
Optical Connectivity for Embedded Systems – Advancements & Use Cases
Matthew Burns, Global Director, Technical Marketing, Samtec
Front panel pluggable optical transceivers are the work horse of data center, hyperscale, and cloud connectivity. Mid-board or on-board optical transceivers offer improved performance and form factor advantages for optical connectivity in embedded applications. In this presentation, Matthew Burns will detail Samtec’s FireFly™ Micro Flyover System™. Additionally, he will introduce FireHawk™ Rugged Optical Transceivers designed for land, sea, air and space applications while publicly launching next-gen 112 Gbps PAM4 mid-board optical transceivers ideally for high-performance embedded applications.
Expanding the Applications Scope with Intelligent Coherent Pluggables
Fady Masoud, Senior Director for Solutions Marketing, Infinera
This session describes how coherent pluggables, leveraging the latest technology innovations, can simplify network architecture, reduce operating costs and enhance service flexibility in a wide set of point-to-point and point-to-point based applications – from Metro Access to Core and Long Haul.
Ultra Optical System for sustainable terabit networking
Muhammed Sarwar, Fujitsu Network Communications
Description: This session covers the latest innovations and technologies packed in Fujitsu’s Ultra Optical System, to optimize reach, capacity and operations in the most sustainable way.
IPEC Overview of Optoelectronic Technology and Industry Standards in the AI Era
The International Photonics & Electronics Committee (IPEC)
In the AI era, explosive traffic growth will push the throughput of the data center to new heights. The evolution path of 100T+ is under extensive exploration, and there may be various options identified.
At the same time, wireless development is inseparable from wireline support. The wireless industry is moving towards 5G+, with more antennas and frequency bands are used, the fronthaul interface also has been increased to 25 Gbit/s or even higher.
Oriented to the evolution of high-speed optical interfaces, IPEC is an open international standards organization focusing on the new technologies of optical chips, optical/electrical components, and optical modules.
At this session, IPEC will describe the evolution of 5G and DCN optical interface, and the progress of IPEC’s Technical Working Groups.
Scaling to 800G pluggables: Opportunities and challenges for coherent
Frank Chang, Senior Director, Product Line Management, Ciena
As technology evolves and bauds increase to allow data-rates of 800G in pluggable modules, new applications now become addressable, with requirements differing between hyperscalers and service providers. 800G pluggables are being developed to support both standards and MSA-based designs, as well as proprietary modes for extended reach. This presentation describes the challenges to support symbol rates of up to 140Gbaud, as well as the technical innovations leading the evolution of standards for 800G coherent pluggables. Finally, details of how these pluggables fit into existing and new applications will be discussed, highlighting the differing design requirements to address these diverse applications.
QXP Innovative Silicon-based new materials for Photonic Integration
Doug Cheng, Doctor, Founder, QXP Technologies Inc.
QXP Silicon-based new materials with extrem low loss and compact advantages, which lead to innovative products, such as Single Lambda Bi-Directional Transceiver TRx, DML repleace EML TRx, and Large Scale Optical Switch.
TeraVERSE: Unleash CPO with Detachable HVM Fiber Connectivity
Amit Miron, VP Product Management, Teramount
Amit Miron, VP Product Management will unveil TeraVERSE: Teramount’s revolutionary detachable connector for CPO. With its cutting edge technology, TeraVERSE ensures optimal fiber assembly yield, high-volume manufacturing, in-field fiber serviceability with substantial cost savings.
Tuesday 3rd October
Versatile Micro-Optics for Miniaturizing and Enabling Emerging Optical Systems
Wilfried Noell – Senior Principal Scientist, SUSS MicroOptics SA
Optical applications such as LIDAR, 3D-sensing, on-board optical data links for next generation chiplets, fluorescence cytometry and endoscopy are consistently growing in market size and are broadening their areas of utilization. As a consequence these systems have to shrink further in size while still increasing their performance levels and capabilities.
Our micro-optics are addressing and enabling these applications with proven micro-optical components and novel developments alike. The level of integration and optical functionality is steadily increasing in our micro-optical components and we are currently further extending our manufacturing capabilities to even larger volumes.
We will present our advances in diffractive and refractive microoptics, laser collimation optics, microprisms with integrated microlenses for large port counts, fiber couplers for PICs and silicon photonics, beam homogenizers, spot generators, optical diffusers and pattern generators for microprojectors.
The Open XR Forum Industry Update
Multiple Speakers, Open XR Forum
This session provides an overview of the XR Optics management and transceivers specifications roadmap, an update on the latest Proof of Concepts (PoC), as well as an update on the Open XR Forum activities within the optical networking industry.
An introduction to the Dutch semiconductor and integrated photonics ecosystems covering the entire supply chain
Carol de Vries, Chief Technology Officer at PhotonDelta and Ben van der Zon, program manager internationalisation and innovation at High Tech NL, Holland High Tech
In this session we will provide an overview of the unique ecosystem in the Netherlands, where semiconductor design knowledge, optics, integrated photonics and heterogeneous integration all come together to form a complete supply chain to the benefit of the user. Carol will present the developments in the PhotonDelta ecosystem and the role of the Dutch Growth Fund as well as the (integrated) photonics companies involved, whilst Ben will focus on the semiconductor industry in the Netherlands and the Dutch strengths in optics.
Scaling 3D Laser Lithography-Based Packaging of Hybrid Multi-Chip Assemblies from Prototyping to Volume Production
Thorsten Mayer, CEO, Vanguard Automation
Highly automated fabrication of compact chip-to-chip packaging with 3D nano-printed micro-optics will overcome limitations of conventional high-precision micro-assembly for volume production.
Driven by mega trends such as the IoT, AI, and autonomous driving, PICs have been growing at a CAGR of greater 20%. Conventional packaging approaches are unlikely to keep up with short innovation cycles and future volume requirements.
Photonic Wire Bonding has brought tremendous progress in leveraging 3D laser lithography to fabricate densely packaged multi-chip assemblies that meet tight optical and environmental specifications. Micro optical lenses can be directly fabricated on wafers, allowing for passive alignment of PICs with low coupling losses. Yet, key to bringing this to volume production and allowing for short innovation cycles, is a software defined fully automated tool-chain.
Advantages of Optical CXL for Disaggregated Compute Architectures
Ron Swartzentruber. Lightelligence
Composable data center architectures provide the ability to disaggregate compute, memory, and network fabric resources. With CXL-capable processors, accelerators, switches, and memories, massive systems can be built to coherently connect compute arrays to memory. The need to train large AI models in machine learning applications will propel the demand for disaggregated architectures. Processor-to-memory bandwidth and latency are critical factors which impact time to train large AI models. Traditional Ethernet and PCIe copper PHY technologies have latency and distance limitations and cannot scale beyond a single rack. CXL over optics can solve the distance, latency, and bandwidth challenges.
This presentation will illustrate the latency and performance improvements that can be achieved through implementing an optical CXL fabric in a computing system. We will discuss the benefits of memory pooling with disaggregated memories for AI training. Evidence will show the distance advantages and interconnect area savings obtained by transmitting multiple CXL data lanes over optical fibers. Benefits of optics will be examined with results from a memory expansion application.
Silicon Photonics and LiDAR Sensing Technology
Marcus Yang, Sr. Director, Head of Silicon Photonics Sensing, Intel
Silicon Photonics (SiP) integrates seamlessly, boosting processing speed while minimizing power consumption, chip sizes, and costs. Its applications range from communications to sensing and computing.
In sensing, SiP enables compact, reliable FMCW LiDAR for autonomous vehicles and extends to environmental sensing and optical gyroscopes. SiP enhances FMCW LiDAR with velocity detection and extended measurement ranges, all while operating efficiently. Intel’s SiP, a mature high-volume platform, provides on-chip gain for lasers and SOAs, a vital component for FMCW LiDAR. Its versatile components benefit a variety of applications, making it a potent and adaptable technology.
Wednesday 4th October
Introduction to PIC packaging and the new Swiss PIC photonics integration center
Peter Morten Moselund, CEO, Swiss PIC
Photonic integrated circuits (PICs) technology is rapidly growing, but many new explorations of the technology have trouble transitioning from proof of principle demonstrations in the lab to actual products because there is limited options for getting raw PIC systems packaged into field deployable systems. Swiss PIC is a new photonics integration center which will support customers in packaging PICs from single proof of principle units and up to pilot series production. We will give an introduction to the challenges to consider when preparing a PIC for packaging and present the services which Swiss PIC offers.
Wire Bondable NTC thermistor and AuSn alloy solder paste for Thermal management in Optical module.
Kobun Oh, Mitsubishi Material Corporation
“Thermal management” is one of the most important topics for the design in optical communication modules that achieve high-speed high-capacity, low-power consumption, and miniaturization. To achieve the above, we have developed two types of state-of-the-art products. (1) Wire Bondable NTC thermistor is a temperature sensor characterized by high precision (+/- 0.3%) with stable and longer aging reliability (125℃/2,000hr). (2) AuSn alloy solder paste makes it possible to form a layer with high heat dissipation and high reliability where desired using a flexible application method. Therefore, we are able to provide better solution effectively for thermal management.
Integrated InP Platform from 10GB to 100GB Applications and beyond
Dr. Xin Chen, Principal Engineer, Ipswich Research Center, Huawei.
Integrated InP technology has been known for its performance and versatility. We review our integrated InP platform in terms of transmission distance from medium to short reach including Data Center applications, also in terms of baud rate from 10GB to 100GB and beyond.
EPIC TechWatch
Multiple speakers
This technology session is a part of the Product focus session at ECOC exhibition where exhibiting EPIC members will get a chance to introduce their technology.
Join us on Wednesday 4 October to get to know the latest innovative products, live demonstrations and technology announcements.
Modulators for Applications at 100 GHz and Beyond
Stephan Koch, VP M&S, Polariton Technologies Ltd
Polymers have been known for being a promising platform as EO materials since a long time. Research looks back at a decade of milestones achieved in terms of top speed, progress in terms of lower losses and long-term reliability. Commercialization of plasmonic devices has now progressed to the stage where test and measurement applications can profit from bandwidths well above 100 GHz and the leap into communications is foreseeable.
Meet this years Product Focus speakers
Wilfried Noell, Senior Principle Scientist, SUSS MicroOptics SA
Wilfried Noell is responsible for advanced technology reviews, complex optical designs, special client requests and business development. Before joining SUSS MicroOptics, he was an R&D scientist and process engineer in the industrial X-ray business unit of the COMET AG, Switzerland. From 1994 through 2012, he worked on InP PICs, Silicon Photonics (SiPH), Optical MEMS (MOEMS) and MEMS actuators at TU Darmstadt, IMM Mainz, IMT/Uni Neuchâtel and EPFL, Switzerland, respectively. Before becoming the Senior Principle Scientist at SUSS MicroOptics, he held the positions of Chief Scientist and Director of R&D for 9 years. Since 2021, he is a member of the Swiss NTN Photonics Innovation Board.
Ron Swartzentruber, Director of Engineering, Lightelligence, Inc
Ron Swartzentruber is the Director of Engineering at Lightelligence, Inc. and is responsible for the development of CXL-over-optics products used for inter-connecting CPUs and memory over an optical fabric. Ron has extensive experience in silicon design and architecture for the cloud networking and network communication industries and holds 21 patents for inventions conceived throughout his career.
Dr Ben van der Zon
Ben van der Zon is in charge for international relations at High Tech NL – Holland Semiconductors both on cluster level as on company/RTO level with a specific focus on the combination of semiconductor technology and photonics Ben read and has a PhD in solid state physics from the University of Leiden and has over 30 years’ experience in R&D for high tech and complex systems. He held R&D (management) positions in the defence industry, semiconductor industry, government and in institutes. Dr. Van der Zon is active for High Tech NL since 2012 and was one of the actors that founded the Silicon Europe Alliance.
Carol de Vries
Carol de Vries is Chief Technology Officer at Photondelta, focusing on technology development, new applications and business opportunities in Integrated Photonics He has a long history in the electronics industry working in R&D and business management in the fields of semiconductors, sensors and systems. He studied Physics at the University of Eindhoven (MsC) and worked for Philips , NXP and Sensata in various roles such as Vice President R&D ,CTO and General Manager, gaining experience in automotive and other B2B industries Starting at PhotonDelta in 2019, recently his focus has been on the PhotonDelta growth fund developing new application domains and supporting startups.
Kobun Oh
Kobun Oh (Mr.) joined Mitsubishi Material Corporation in 2018. He is in charge of Sales & Market Research of NTC thermistor and AuSn alloy solder paste which can be use in optical communication module. He has experience in this market more than 5 years and takes care of key customers in many Countries such as Japan, Germany, UK, US, China and more.
Fady Masoud
Fady Masoud is a Senior Director for Solutions Marketing at Infinera focusing on Intelligent Coherent Pluggable optics (ICE-X). During his 27 years in the telecommunications industry, Fady has held various positions in the optical networking domain at Nortel, Ciena, and now Infinera. He started as a hardware engineer on the first 10 Gb/s systems and then was a systems and network engineer on metropolitan optical products. Fady holds a bachelor’s degree in electrical engineering from Laval University (Quebec City, Canada) and a master’s degree in systems technology from the Superior School of Technology (Montreal, Canada).
Frank Chang
Frank Chang is senior director of product management at Ciena, responsible for the introduction of Ciena’s WaveLogic coherent modems product line. For over two decades, Frank served as product management lead in multiple networking companies including Nortel, BTI Systems and Coriant. His experience managing switching/routing as well as transport platforms has given him a valuable user perspective on optics and coherent modems. When not charting product roadmaps, Frank can often be found on park trails running, cycling or cross-country-skiing.
Peter Moselund
Peter Moselund is the CEO in charge of establishing Swiss PIC. He has a PhD and 15 years industrial experience in photonics. He was 12 years at NKT Photonics, initially as a R&D engineer but later as a Group leader building up what became the company’s Future Technologies group and managing all the company’s 28 government projects. Later he founded the photonics startup PM² Photonics and on the side he is an active investor in tech startups and serving on several company boards.
Doug Cheng
Doug Cheng, founder of QXP Technologies Inc. Member of the Optical Society of America Graduated from Helsinki University of Technology with PHD in Optical Communication and Optoelectronics
Stephan Koch
With 30 years of experience in the semiconductor and test & measurement markets, Stephan is the leader and catalyst for sales, customer focused approaches, and the professionalization of Polariton Technologies Inc. Prior to his time at Polariton, Stephan held key positions at Zurich Instruments, Philips Semiconductors, and NXP. Stephan's desire for adventure led him to take the leap from an international organization to a smaller company with big potential. His experience in international business is pivotal for our culture-aware implementation of Polariton’s market strategies. Since joining in 2022, Stephan has been a driving force behind the company's go-to-market strategy and supporting the development of the organization. In addition to his professional accomplishments, Stephan is a passionate triathlete, who inspires his colleagues to give their best in both sport and work. He holds an MSc in Electrical Engineering, as well as an MBA degree from ETH Zurich.
Dr. Xin Chen
Dr. Xin Chen is a Principal Engineer at Ipswich Research Center, Huawei. He received his Ph.D from Aalborg University, Denmark, and has worked in academia including York University, Manchester University, Cambridge University and industry including Corning Research Center, CIP Technologies, and Huawei Technologies. He has published over 60 peer-reviewed papers and holds over 20 patents. His recent work is focusing on high-speed semiconductor transmitters.
Amit Miron
Amit is a Senior technology executive with over 22 years of experience in Product Management and Development roles across various global companies, specializing in establishing and evolving product teams. Prior to joining Teramount, Amit has held senior Product Management positions in Parallel Wireless, Airspan and Nokia-Siemens Networks. Amit has a BSc in Electrical Engineering from Tel Aviv University.
Muhammad Sarwar is currently distinguished global planner at Fujitsu Network Communications. He is responsible for strategy and planning of portfolio offerings. He holds MS degree in Electrical Engineering from Columbia University in New York and is author of 10+ US patents related to data communications, optical transport, and network security.
Matthew Burns
Matthew Burns develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. Mr. Burns holds a B.S. in Electrical Engineering from Penn State University.