Monday 2nd October

Optical Connectivity for Embedded Systems – Advancements & Use Cases

Matthew Burns, Global Director, Technical Marketing, Samtec

Front panel pluggable optical transceivers are the work horse of data center, hyperscale, and cloud connectivity. Mid-board or on-board optical transceivers offer improved performance and form factor advantages for optical connectivity in embedded applications. In this presentation, Matthew Burns will detail Samtec’s FireFly™ Micro Flyover System™. Additionally, he will introduce FireHawk™ Rugged Optical Transceivers designed for land, sea, air and space applications while publicly launching next-gen 112 Gbps PAM4 mid-board optical transceivers ideally for high-performance embedded applications.

Securing the next generation transport networks with AMD’s programmable Silicon

Awanish Verma, Director – Technical Marketing, AMD

Next generation transport networks are evolving and need higher performance with more sophisticated security requirements. The security requirements have increased for physical, datalink and network layer. The emergence of quantum safe security protocols with emergence of quantum computing has further enhanced the complexity of implementation. This presentation talks about implementing the multiple security protocols for network layers using AMD programmable devices. It also covers the 800G transport solutions with support for security at transport and MAC layer.


Expanding the Applications Scope with Intelligent Coherent Pluggables

Fady Masoud, Senior Director for Solutions Marketing, Infinera

This session describes how coherent pluggables, leveraging the latest technology innovations, can simplify network architecture, reduce operating costs and enhance service flexibility in a wide set of point-to-point and point-to-point based applications – from Metro Access to Core and Long Haul.

Ultra Optical System for sustainable terabit networking

Muhammed Sarwar, Fujitsu Network Communications

Description: This session covers the latest innovations and technologies packed in Fujitsu’s Ultra Optical System, to optimize reach, capacity and operations in the most sustainable way.

IPEC Overview of Optoelectronic Technology and Industry Standards in the AI Era

 The International Photonics & Electronics Committee (IPEC)

In the AI era, explosive traffic growth will push the throughput of the data center to new heights. The evolution path of 100T+ is under extensive exploration, and there may be various options identified.

At the same time, wireless development is inseparable from wireline support. The wireless industry is moving towards 5G+, with more antennas and frequency bands are used, the fronthaul interface also has been increased to 25 Gbit/s or even higher.

Oriented to the evolution of high-speed optical interfaces, IPEC is an open international standards organization focusing on the new technologies of optical chips, optical/electrical components, and optical modules.

At this session, IPEC will describe the evolution of 5G and DCN optical interface, and the progress of IPEC’s Technical Working Groups.

Scaling to 800G pluggables: Opportunities and challenges for coherent

Frank Chang, Senior Director, Product Line Management, Ciena

As technology evolves and bauds increase to allow data-rates of 800G in pluggable modules, new applications now become addressable, with requirements differing between hyperscalers and service providers.  800G pluggables are being developed to support both standards and MSA-based designs, as well as proprietary modes for extended reach. This presentation describes the challenges to support symbol rates of up to 140Gbaud, as well as the technical innovations leading the evolution of standards for 800G coherent pluggables. Finally, details of how these pluggables fit into existing and new applications will be discussed, highlighting the differing design requirements to address these diverse applications.


QXP Innovative Silicon-based new materials for Photonic Integration

Doug Cheng, Doctor, Founder, QXP Technologies Inc.

QXP Silicon-based new materials with extrem low loss and compact advantages, which lead to  innovative products, such as Single Lambda Bi-Directional Transceiver TRx, DML repleace EML  TRx, and Large Scale Optical Switch.


TeraVERSE: Unleash CPO with Detachable HVM Fiber Connectivity

Amit Miron, VP Product Management, Teramount

Amit Miron, VP Product Management will unveil TeraVERSE: Teramount’s revolutionary detachable connector for CPO. With its cutting edge technology, TeraVERSE ensures optimal fiber assembly yield, high-volume manufacturing, in-field fiber serviceability with substantial cost savings.

Tuesday 3rd October

Versatile Micro-Optics for Miniaturizing and Enabling Emerging Optical Systems

Wilfried Noell – Senior Principal Scientist, SUSS MicroOptics SA

Optical applications such as LIDAR, 3D-sensing, on-board optical data links for next generation chiplets, fluorescence cytometry and endoscopy are consistently growing in market size and are broadening their areas of utilization. As a consequence these systems have to shrink further in size while still increasing their performance levels and capabilities.

Our micro-optics are addressing and enabling these applications with proven micro-optical components and novel developments alike. The level of integration and optical functionality is steadily increasing in our micro-optical components and we are currently further extending our manufacturing capabilities to even larger volumes.

We will present our advances in diffractive and refractive microoptics, laser collimation optics, microprisms with integrated microlenses for large port counts, fiber couplers for PICs and silicon photonics, beam homogenizers, spot generators, optical diffusers and pattern generators for microprojectors.

The Open XR Forum Industry Update

Multiple Speakers, Open XR Forum

 This session provides an overview of the XR Optics management and transceivers specifications roadmap, an update on the latest Proof of Concepts (PoC), as well as an update on the Open XR Forum activities within the optical networking industry.

An introduction to the Dutch semiconductor and integrated photonics ecosystems covering the entire supply chain

Carol de Vries, Chief Technology Officer at PhotonDelta and Ben van der Zon, program manager internationalisation and innovation at High Tech NL,  Holland High Tech 

In this session we will provide an overview of the unique ecosystem in the Netherlands, where semiconductor design knowledge, optics, integrated photonics and heterogeneous integration all come together to form a complete supply chain to the benefit of the user. Carol will present the developments in the PhotonDelta ecosystem and the role of the Dutch Growth Fund as well as the (integrated) photonics companies involved, whilst Ben will focus on the semiconductor industry in the Netherlands and the Dutch strengths in optics.


Scaling 3D Laser Lithography-Based Packaging of Hybrid Multi-Chip Assemblies from Prototyping to Volume Production

Thorsten Mayer, CEO, Vanguard Automation

Highly automated fabrication of compact chip-to-chip packaging with 3D nano-printed micro-optics will overcome limitations of conventional high-precision micro-assembly for volume production.

Driven by mega trends such as the IoT, AI, and autonomous driving, PICs have been growing at a CAGR of greater 20%. Conventional packaging approaches are unlikely to keep up with short innovation cycles and future volume requirements.

Photonic Wire Bonding has brought tremendous progress in leveraging 3D laser lithography to fabricate densely packaged multi-chip assemblies that meet tight optical and environmental specifications. Micro optical lenses can be directly fabricated on wafers, allowing for passive alignment of PICs with low coupling losses. Yet, key to bringing this to volume production and allowing for short innovation cycles, is a software defined fully automated tool-chain.

Advantages of Optical CXL for Disaggregated Compute Architectures

Ron Swartzentruber. Lightelligence

Composable data center architectures provide the ability to disaggregate compute, memory, and network fabric resources. With CXL-capable processors, accelerators, switches, and memories, massive systems can be built to coherently connect compute arrays to memory.  The need to train large AI models in machine learning applications will propel the demand for disaggregated architectures. Processor-to-memory bandwidth and latency are critical factors which impact time to train large AI models. Traditional Ethernet and PCIe copper PHY technologies have latency and distance limitations and cannot scale beyond a single rack. CXL over optics can solve the distance, latency, and bandwidth challenges.

This presentation will illustrate the latency and performance improvements that can be achieved through implementing an optical CXL fabric in a computing system. We will discuss the benefits of memory pooling with disaggregated memories for AI training. Evidence will show the distance advantages and interconnect area savings obtained by transmitting multiple CXL data lanes over optical fibers. Benefits of optics will be examined with results from a memory expansion application.

Silicon Photonics and LiDAR Sensing Technology

Marcus Yang, Sr. Director, Head of Silicon Photonics Sensing, Intel

Silicon Photonics (SiP) integrates seamlessly, boosting processing speed while minimizing power consumption, chip sizes, and costs. Its applications range from communications to sensing and computing.

In sensing, SiP enables compact, reliable FMCW LiDAR for autonomous vehicles and extends to environmental sensing and optical gyroscopes. SiP enhances FMCW LiDAR with velocity detection and extended measurement ranges, all while operating efficiently. Intel’s SiP, a mature high-volume platform, provides on-chip gain for lasers and SOAs, a vital component for FMCW LiDAR. Its versatile components benefit a variety of applications, making it a potent and adaptable technology.

Wednesday 4th October

Introduction to PIC packaging and the new Swiss PIC photonics integration center

Peter Morten Moselund, CEO, Swiss PIC

Photonic integrated circuits (PICs) technology is rapidly growing, but many new explorations of the technology have trouble transitioning from proof of principle demonstrations in the lab to actual products because there is limited options for getting raw PIC systems packaged into field deployable systems. Swiss PIC is a new photonics integration center which will support customers in packaging PICs from single proof of principle units and up to pilot series production. We will give an introduction to the challenges to consider when preparing a PIC for packaging and present the services which Swiss PIC offers.

Wire Bondable NTC thermistor and AuSn alloy solder paste for Thermal management in Optical module.

Kobun Oh, Mitsubishi Material Corporation

“Thermal management” is one of the most important topics for the design in optical communication modules that achieve high-speed high-capacity, low-power consumption, and miniaturization. To achieve the above, we have developed two types of state-of-the-art products. (1) Wire Bondable NTC thermistor is a temperature sensor characterized by high precision (+/- 0.3%) with stable and longer aging reliability (125℃/2,000hr).  (2) AuSn alloy solder paste makes it possible to form a layer with high heat dissipation and high reliability where desired using a flexible application method. Therefore, we are able to provide better solution effectively for thermal management.


Integrated InP Platform from 10GB to 100GB Applications and beyond

Dr. Xin Chen, Principal Engineer, Ipswich Research Center, Huawei.

Integrated InP technology has been known for its performance and versatility. We review our integrated InP platform in terms of transmission distance from medium to short reach including Data Center applications, also in terms of baud rate from 10GB to 100GB and beyond.


EPIC TechWatch

Multiple speakers

This technology session is a part of the Product focus session at ECOC exhibition where exhibiting EPIC members will get a chance to introduce their technology.
Join us on Wednesday 4 October to get to know the latest innovative products, live demonstrations and technology announcements.


Modulators for Applications at 100 GHz and Beyond

Stephan Koch, VP M&S, Polariton Technologies Ltd

Polymers have been known for being a promising platform as EO materials since a long time. Research looks back at a decade of milestones achieved in terms of top speed, progress in terms of lower losses and long-term reliability. Commercialization of plasmonic devices has now progressed to the stage where test and measurement applications can profit from bandwidths well above 100 GHz and the leap into communications is foreseeable.



Meet this years Product Focus speakers