Monday 2nd October |
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| Start time | Finish time | Title | Speaker | Company | |
| 10:00 | 10:30 | Optical Connectivity for Embedded Systems – Advancements & Use Cases | Matthew Burns
Global Director, Technical Marketing |
Samtec | |
| 10:40 | 11:10 | TBC | TBC | Xilinx Ireland Unlimited Company | |
| 11:20 | 11:50 | Expanding the Applications Scope with Intelligent Coherent Pluggables | Fady Masoud, Senior Director for Solutions Marketing | Infinera | |
| 12:00 | 12:30 | Ultra Optical System for sustainable terabit networking | Muhammad Sarwar | Fujitsu Network Communications | |
| 12:40 | 14:40 | IPEC 2-hr | IPEC | ||
| 12:40 –12:45 Opening | |||||
| 12:45 – 12:55 Welcome & Intro | Hideki Isono, Vice President, IPEC & Consultant, Fujitsu Optical Components/ IGS Consulting | ||||
| 12:55 – 13:10 Exploration and Prospect of OIO and LPO by IPEC Advanced Technology Working Group | Eric Bernier, Chief Editor, IPEC | ||||
| 13:10 – 13:25 Progress of the IPEC Wireless Fronthaul 50G Standard Project | Jia Feng, Chief Editor, IPEC | ||||
| 13:25 – 13:40 IPEC Test Specifications and Platforms for 400G&800G | Lu Liu, Chair of PlugFest Working Group, IPEC & Senior Engineer of CAICT | ||||
| 13:40 – 13:55 The Perfect Storm at 800G | Jim Theodoras, IPEC Member & Vice President, Research & Development, HG Genuine USA | ||||
| 13:55 – 14:10 Linear Pluggable Optics Modules for Data Center Interconnects | Michael Xin, IPEC Member & VP of Sales and Marketing, CIG USA. | ||||
| 14:10 – 14:25 100T High Density VSFF Optical Interconnects | Tiger Ninomiya, IPEC Member & Senior Technologist, Senko Advanced Components Inc. | ||||
| 14:25 – 14:40 TBD | Richard Xiao, Vice President, GM of Optical Interconnection BU, Linktel Technologies | ||||
| 14:50 | 15:20 | Scaling to 800G pluggables: Opportunities and challenges for coherent | Frank Chang, Senior Director, Product Line Management | Ciena | |
| 15:30 | 16:00 | QXP Innovative Silicon-based new materials for Photonic Integration | Doug Cheng, Doctor, Founder | QXP Technologies Inc. | |
| 16:10 | 16:40 | TeraVERSE: Unleash CPO with Detachable HVM Fiber Connectivity | Amit Miron, VP Product Management | Teramount | |
| View session details and speaker information | |||||
Tuesday 3rd October |
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| Start time | Finish time | Title | Speaker | Company | |
| 09:30 | 09:50 | Versatile Micro-Optics for Miniaturizing and Enabling Emerging Optical Systems | Wilfried Noell (Senior Principle Scientist) | SUSS MicroOptics SA | |
| 10:00 | 11:30 | The Open XR Forum Industry Update | Multiple speakers | Infinera | |
| 11:40 | 13:00 | ECOC Industry Awards | ECOC | ||
| 13:00 | 14:30 | An introduction to the Dutch semiconductor and integrated photonics ecosystems covering the entire supply chain | Carol de Vries, Chief Technology Officer at PhotonDelta and Ben van der Zon, program manager internationalisation and innovation at | Holland High Tech | |
| 14:40 | 15:10 | Scaling 3D Laser Lithography-Based Packaging of Hybrid Multi-Chip Assemblies from Prototyping to Volume Production | Thorsten Mayer,CEO | Vanguard Automation | |
| 15:20 | 15:50 | Advantages of Optical CXL for Disaggregated Compute Architectures | Ron Swartzentruber, Director of Engineering | Lightelligence | |
| 16:00 | 16:30 | Silicon Photonics and LiDAR Sensing Technology | Marcus Yang, Sr. Director, Head of Silicon Photonics Sensing | Intel Corporation | |
| View session details and speaker information | |||||
Wednesday 4th October |
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| Start time | Finish time | Title | Speaker | Company | |
| 09:30 | 10:00 | Introduction to PIC packaging and the new Swiss PIC photonics integration center | Peter Morten Moselund, CEO | Swiss PIC | |
| 10:10 | 10:40 | Wire Bondable NTC thermistor and AuSn alloy solder paste for Thermal management in Optical module | Kobun Oh | Mitsubishi Materials Corp | |
| 10:50 | 11:20 | Integrated InP Platform from 10GB to 100GB Applications and beyond | Dr. Xin Chen | Ipswich Research Centre, Huawei Technologies UK Research & Develop ltd. | |
| 11:50 | 14:50 | EPIC Techwatch | |||
| 11:50 – 12:05 Welcome and introduction by EPIC | |||||
| 12:05 – 12:20 VLC Photonics – Scaling up the photonic testing back-end | Iñigo Artundo, CEO | ||||
| 12:20 – 12:35 VPIphotonics | TBA | ||||
| 12:35 – 12:50 Ligentec – Volume ready fabrication of low loss photonic integrated circuits | Michael Gieselmann, Co-Founder | ||||
| 12:50 – 13:05 Vario Optics – On-board photonic integration – closing the gap between PICs and optical glass fibers | Nikolaus Flöry, Business Development Manager | ||||
| 13:05 – 13:20 Fraunhofer HHI – RFconnect – A compact RF PIC assembly for fast and convenient prototype development up to 40 GHz | Axel Schönau, Research Associate/Project Manager | ||||
| 13:20 – 13:35 Quantifi Photonics | Iannick Monfils, CTO | ||||
| 13:35 – 13:50 FEMTOprint – Laser-based 3D micro-manufacturing of high precision components for fiber-to-chip connectivity in integrated & quantum photonics | Rolando Ferrini, Chief Regional Officer (CRO) & Head of FEMTOprint Neuchâtel | ||||
| 13:50 – 14:05 Albis Optoelectronics | Hektor Meier, Head of Product Development | ||||
| 14:05 – 14:20 Vector Photonics – PCSELs For Quantum Applications | Euan Livingston, Director of Sales and Marketing | ||||
| 14:20 – 14:35 MicroAlign – Micro actuators for independent manipulation of optical fibers in a fiber array: a route towards perfect fiber array connectivity | Simone Cardarelli, CEO | ||||
| 14:35 – 14:50 Networking | |||||
| 15:00 | 15:30 | Modulators for Applications at 100 GHz and Beyond | Stephan Koch, VP M&S | Polariton Technologies Ltd | |
| View session details and speaker information | |||||