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Monday 19th September

DayStart timeFinish timeTitleCompanySpeaker
Monday 19th September11:2011:50Beyond 800G pluggable – what challenges lie ahead for the ecosystemVIAVI solutionsDr Paul Brooks, Director of Product and Technology Support
Monday 19th September12:0012:30The Growing Need for Tunable Lasers: Focus on Metro, DCI and Access NetworksEffect PhotonicsJoost Verberk, Director of Product Management
Monday 19th September12:4013:10Extending Coherent to the Edge with XR OpticsInfineraFady Masoud, Director, Solutions Marketing
Monday 19th September13:2013:50Novel micro-optics solutions through monolithic integration of microlenses and prismsSUSS MicroOpticsWilfried Noell, Director of Research and Development  and Justine Lullin, Project and Engineering Manager
Monday 19th September14:0014:30A Novel Fiber Assembly for Co-Packaged OpticsTeramount Ltd.Hesham Taha, PhD, CEO
Monday 19th September14:4015:10Avicena’s LightBundle GaN microLEDs on Silicon enable ultra-low Energy Interconnects for Chip-to-Chip CommunicationsAvicenaChris Pfistner  Vice President, Sales & Marketing
Monday 19th September15:2015:50iCLA – integrated comb laser assembly for coherent DWDM superchannelsPilot PhotonicsDr. Frank Smyth, Founder and CTO
Monday 19th September16:0016:30Latest innovations and optical fibre benefits in the automotive and industrial sectorKDPOFCarlos Pardo, CEO at KDPOF

Tuesday 20th September

DayStart timeFinish timeTitleCompanySpeaker
Tuesday 20th September09:3010:00State of play of FTTH roll out in EuropeFTTH Council EuropeVincent Garnier, Director General
Tuesday 20th September10:1011:10ECOC Exhibition Industry Awards AnnouncementsECOC TV
Tuesday 20th September11:2011:50Testing essentials for your MPO systemEXFOAlfonso Domesi, EMEA Business Development Manager
Tuesday 20th September12:0012:30The Opportunities and Design Challenges of Co-packaged OpticsAnsysDr. James Pond, Distinguished Engineer
Tuesday 20th September12:4013:10Innovation in 5G Wireless IC Technology: Optical Front Haul TransportSemtech CorporationRaza Khan  Senior Marketing Manager, Wireless Products  Semtech Signal Integrity Product Group
Tuesday 20th September14:0014:30Telecom Infra Project  – Open Optical and Packet Transport (TIP OOPT) : MANTRA IntroductionMeta Inc.Arturo Mayoral López de Lerma, Telecom Infra Project
Tuesday 20th September14:4015:10PAM4 SR and AOC solution in HPC and data centerOptomindYung Son, CTO and CMO
Tuesday 20th September15:2015:50Connectivity to You: The Importance of Quality and Reliability for Outside Plant Components, and the Role of Photonic Integration therein.Shanghai EnsureErik Pennings, Business Development Director
Tuesday 20th September16:0016:30Photonics based AI-service, which includes remote access to CogniFiber Aurora: a trainable classifier that operates at 100 million tasks/secCognifiberProf. Zeev Zalevsky

Wednesday  21st September

DayStart timeFinish timeTitleCompanySpeaker
Wednesday 21st September10:3013:00EPIC TechWatch at ECOC

10:30 – 10:45 Welcome and introduction by EPIC

10:45 – 12:30 Presentations:

Advanced Photonics Integrated Packaging Solutions Enabling the Next Generation Optical Connectivity – Carlos Viana, CEO at ICON Photonics

Photonics Packaging in Datacenter Focused Applications – Giorgio Cazzaniga, Director of Product Management by Jabil

Advanced Material Solutions for Packaged Optoelectronic Devices – Luca Mauri, Head of the Getters & Dispensers Development Laboratory at SAES Group

PHABULOuS – Fabrication Technologies for Free-form Optics – Ton Offermans, Technical Coordinator at PHABULOuS Pilot Line / CSEM

JePPIX: Scaling up InP PIC Production – Kevin Williams, Professor and Chair of the Photonic Integration research group at TU Eindhoven / JePPIX

PDKs of the Future: Enabling a Modular Design Ecosystem – Pierre Wahl, Co-founder & Global Sales Director at Luceda Photonics

Photonic Integration Based Devices for Tunable and Next Generation Networks Speaker – Francisco Rodrigues, CEO at PICadvanced

12:30 – 13:00 Networking

Wednesday 21st September13:1013:40112G/224G-PAM4 connectivity – inside and outside the optical moduleYamaichi ElectronicsDavid Binder, Business Development Manager, Data Networking