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Monday 19th September

Day Start time Finish time Title Company Speaker
Monday 19th September 11:20 11:50 Beyond 800G pluggable – what challenges lie ahead for the ecosystem VIAVI solutions Dr Paul Brooks, Director of Product and Technology Support
Monday 19th September 12:00 12:30 The Growing Need for Tunable Lasers: Focus on Metro, DCI and Access Networks Effect Photonics Joost Verberk, Director of Product Management
Monday 19th September 12:40 13:10 Extending Coherent to the Edge with XR Optics Infinera Fady Masoud, Director, Solutions Marketing
Monday 19th September 13:20 13:50 Novel micro-optics solutions through monolithic integration of microlenses and prisms SUSS MicroOptics Wilfried Noell, Director of Research and Development  and Justine Lullin, Project and Engineering Manager
Monday 19th September 14:00 14:30 A Novel Fiber Assembly for Co-Packaged Optics Teramount Ltd. Hesham Taha, PhD, CEO
Monday 19th September 14:40 15:10 Avicena’s LightBundle GaN microLEDs on Silicon enable ultra-low Energy Interconnects for Chip-to-Chip Communications Avicena Chris Pfistner  Vice President, Sales & Marketing
Monday 19th September 15:20 15:50 iCLA – integrated comb laser assembly for coherent DWDM superchannels Pilot Photonics Dr. Frank Smyth, Founder and CTO
Monday 19th September 16:00 16:30 Latest innovations and optical fibre benefits in the automotive and industrial sector KDPOF Carlos Pardo, CEO at KDPOF

Tuesday 20th September

Day Start time Finish time Title Company Speaker
Tuesday 20th September 09:30 10:00 State of play of FTTH roll out in Europe FTTH Council Europe Vincent Garnier, Director General
Tuesday 20th September 10:10 11:10 ECOC Exhibition Industry Awards Announcements ECOC TV
Tuesday 20th September 11:20 11:50 Testing essentials for your MPO system EXFO Alfonso Domesi, EMEA Business Development Manager
Tuesday 20th September 12:00 12:30 The Opportunities and Design Challenges of Co-packaged Optics Ansys Dr. James Pond, Distinguished Engineer
Tuesday 20th September 12:40 13:10 Innovation in 5G Wireless IC Technology: Optical Front Haul Transport Semtech Corporation Raza Khan  Senior Marketing Manager, Wireless Products  Semtech Signal Integrity Product Group
Tuesday 20th September 14:00 14:30 Telecom Infra Project  – Open Optical and Packet Transport (TIP OOPT) : MANTRA Introduction Meta Inc. Arturo Mayoral López de Lerma, Telecom Infra Project
Tuesday 20th September 14:40 15:10 PAM4 SR and AOC solution in HPC and data center Optomind Yung Son, CTO and CMO
Tuesday 20th September 15:20 15:50 Connectivity to You: The Importance of Quality and Reliability for Outside Plant Components, and the Role of Photonic Integration therein. Shanghai Ensure Erik Pennings, Business Development Director
Tuesday 20th September 16:00 16:30 Photonics based AI-service, which includes remote access to CogniFiber Aurora: a trainable classifier that operates at 100 million tasks/sec Cognifiber Prof. Zeev Zalevsky

Wednesday  21st September

Day Start time Finish time Title Company Speaker
Wednesday 21st September 10:30 13:00 EPIC TechWatch at ECOC

10:30 – 10:45 Welcome and introduction by EPIC

10:45 – 12:30 Presentations:

Advanced Photonics Integrated Packaging Solutions Enabling the Next Generation Optical Connectivity – Carlos Viana, CEO at ICON Photonics

Photonics Packaging in Datacenter Focused Applications – Giorgio Cazzaniga, Director of Product Management by Jabil

Advanced Material Solutions for Packaged Optoelectronic Devices – Luca Mauri, Head of the Getters & Dispensers Development Laboratory at SAES Group

PHABULOuS – Fabrication Technologies for Free-form Optics – Ton Offermans, Technical Coordinator at PHABULOuS Pilot Line / CSEM

JePPIX: Scaling up InP PIC Production – Kevin Williams, Professor and Chair of the Photonic Integration research group at TU Eindhoven / JePPIX

PDKs of the Future: Enabling a Modular Design Ecosystem – Pierre Wahl, Co-founder & Global Sales Director at Luceda Photonics

Photonic Integration Based Devices for Tunable and Next Generation Networks Speaker – Francisco Rodrigues, CEO at PICadvanced

12:30 – 13:00 Networking

Wednesday 21st September 13:10 13:40 112G/224G-PAM4 connectivity – inside and outside the optical module Yamaichi Electronics David Binder, Business Development Manager, Data Networking