Monday 19th September
|11:20 – 11:50||Beyond 800G pluggable – what challenges lie ahead for the ecosystem – Dr Paul Brooks – director of product and technology support, VIAVI Solutions|
|Beyond 800G pluggables are becoming an important theme, we see the early ramp of 800G clients and 400G coherent and now the industry must set out a path of an ecosystem beyond 800G. We give a T&M perspective of the challenges ahead to successful develop and ramp in a post 800G world!|
|12:00 – 12:30||The Growing Need for Tunable Lasers: Focus on Metro, DCI and Access Networks, Joost Verberk, Director of Product Management, Effect Photonics|
|In situations where fiber is not readily available, due to fiber exhaust or limited penetration, tunable lasers and DWDM are helping to expand capacity for metro, DCI and access applications. Even in areas where plenty of fiber is available, those techniques help maximize the ROI of a service provider’s fiber infrastructure. Further, advances in coherent technology and pluggable transceivers have enabled widespread deployment of IP over DWDM services and self-tuning algorithms have simplified the installation and maintenance of DWDM. As a result, metro transport, DCI and future access networks are moving towards coherent tunable pluggables, with annual sales forecast to double by 2026.|
|12:30 – 13:10||Extending Coherent to the Edge with XR Optics – Fady Masoud, Director, Solutions Marketing at Infinera|
|With the number of connected devices and bandwidth demand skyrocketing, service providers are faced with the challenges of coping with massive growth in bandwidth, reducing CapEx/OpEx, and simplifying the network. These challenges can only be overcome by a major shift in technology – extending coherent technology to the edge. This session discusses how XR optics can help service providers extend coherent technology to the edge, enabling an order of magnitude increase in capacity, significant reduction in TCO (70%), dramatic network simplification and software-configurable capacity allocation.|
|13:20 – 13:50||Novel micro-optics solutions through monolithic integration of microlenses and prisms – Wilfried Noell, Director of research and development Justine Lullin, Project and Engineering manager, SUSS MicroOptics|
|Micro-optical solutions based on micro-lenses are unleashing innovation in such diverse fields as 5G, the Internet of Things, autonomous driving. However, the test, assembly and packaging of microscale devices remains a significant challenge. In this context, the compact integration of both micro-lenses and micro-prism provides an enticing solution to challenges faced in many applications such as Photonic Integrated circuit, Optical subassemblies and transceivers or LIDAR. Recently, innovative combination of process technology has allowed SUSS MicroOptics to monolithically integrate lenses and prisms on the micro-scale. We present here the manufacturing of both silicon and fused silica micro-prism integrated on a micro-lens.|
|14:00 – 14:30||A Novel Fiber Assembly for Co-Packaged Optics – Hesham Taha, PhD, CEO, Teramount Ltd|
|Packaging trends for silicon photonics technology are lagging behind the demands of applications that require high bandwidth and low power consumption such as ethernet switches, advanced computing, chip-to-chip optical connectivity and other datacom and telecom applications. A new and effective packaging solution that is compatible with conventional high-volume manufacturing and packaging of the semiconductor industry is required. We report a PhotonicPlug technology that offers a re-workable and detachable connectivity of large number of fibers, an unprecedented ±30µm/0.5dB fiber assembly tolerances, post reflow assembly and full compatibility with co-packaged optics and electronics packages. The PhotonicPlug technology takes advantage from wafer level manufacturing processes for accurate placement of optics and for aligning silicon photonics with standard semiconductor manufacturing and packaging flow.|
|14:40 – 15:10||Avicena’s LightBundle GaN microLEDs on Silicon enable ultra-low Energy Interconnects for Chip-to-Chip Communications – Chris Pfistner Vice President, Sales & Marketing, Avicena|
|Avicena has demonstrated LightBundleTM interconnects with less than 2pJ/bit and will soon unveil sub-1pJ/bit links. The technology is based on arrays of innovative GaN micro-emitters that leverage the microLED display ecosystem and can be integrated into high performance CMOS ICs. The parallel nature of LightBundle™ is well matched to parallel chiplet interfaces like UCIe, OpenHBI, and BoW, and can also be used to extend the reach of compute interconnects like PCIe/CXL, or HBM/DDR/GDDR memory links.|
|15:20 – 15:50||iCLA – integrated comb laser assembly for coherent DWDM superchannels – Dr. Frank Smyth, Founder and CTO, Pilot Photonics Ltd|
|As the industry looks towards 1.6T and 3.2T channel rates, multi-wavelength superchannels are expected to be required. Comb lasers offer benefits over independent lasers in terms of cost, footprint, and power while also enabling enhanced spectral efficiency and reduced DSP complexity. The integrated comb laser assembly (iCLA) builds on the heritage of the industry workhorse, iTLA. It uses gain switched comb source technology and monolithically integrated injection locked demultiplexers to deliver multiple coherent wavelengths on individual fibers from a single module to drive multiple 400G and 800G coherent optical engines.|
|16:00 – 16:30||Latest innovations and optical fibre benefits in the automotive and industrial sector – Carlos Pardo – CEO at KDPOF|
|Noise in large installations, for example in factories, can interfere with communications when copper cables are used. In stand-alone environments, such as a vehicle, we also encounter a lot of communication pollution when using a copper-based system. A fibre optic-based system in Ethernet communication has several advantages that solve the problems caused by interference from different sources. KDPOF will present their next-generation transceivers based on the optical multi-gigabit technology (xGBase-AU standards) and the advantages of its application in the automotive and industrial sector, compared to xGBase-T1 copper solutions, that includes low cost, easy engineering, higher reach, EMC-issues free, galvanic isolation, , industrial temperature range (from -40ºC until 150ºC), robust and low-cost connectors and scalability.|
Tuesday 20th September
|09:30 – 10:00||State of play of FTTH roll out in Europe – Vincent Garnier, Director General, FTTH Council Europe|
|More than half of European households now have access to full fibre connectivity and we witness a surge in Public and Private investment in support of aggressive FTTH roll out plans. However a lot still has to be done to make sure our continent has the fibre infrastructure it requires to meet the challenges of a green and digital society. This review of FTTH roll out throughout Europe will be followed by a focus on the key challenges the industry will be facing in the years to come.|
|10:10 – 11:10||ECOC Exhibition Industry Awards Announcements|
|Hear the winners as they are announced – ECOC TV|
|11:20 – 11:50||Testing essentials for your MPO system – Alfonso Domesi, EMEA Business Development Manager, EXFO|
|Data center, 5G, broadband, and high-speed link deployments are driving the number of multifiber push-on connectors (MPOs) to optimize installation, opening the door to new issues. Get insights into best practices for technicians testing MPO links, including the inspection of MPO connector endfaces; how to mitigate the impact of damaged or dirty multifiber connectors, and streamlined Tier-1 certification of MPO links. In addition to current technologies, testing standards and solutions, the discussion will also cover proper methods of procedure to minimize operational costs and wasted time.|
|12:00 – 12:30||The Opportunities and Design Challenges of Co-packaged Optics – Ansys|
|Silicon photonics is a proven technology for high-speed, low-cost, high-volume pluggable transceivers. However, as data speeds and power budgets become increasingly demanding, there is a market need for co-packaged optics. While initially driven by switching needs, co-packaged optics will enable many innovations, including disaggregated compute architectures. The design of these systems is immensely challenging and requires high performance electronic photonic design automation (EPDA) workflows, as well as solutions to complex multiphysics problems such as the thermal analysis of full 3D ICs with silicon photonic interposers. In this talk, I review the opportunities, challenges and design solutions of co-packaged optics.|
|12:40 – 13:10||Innovation in 5G Wireless IC Technology: Optical Front Haul Transport – Raza Khan Senior Market Manager-Wireless Products, Signal Integrity Products Group, Semtech Corporation|
|IC technology innovation will form an important aspect to enable the 5G applications of the future. We discuss how such innovations are being enabled by semiconductor companies for the eco-system to adopt a 5G foundation that will lay the ground for 5.5G and 6G.|
|13:20 – 13:50|
|14:0o – 14:30||Telecom Infra Project – Open Optical and Packet Transport (TIP OOPT) : MANTRA Introduction – Speaker tbc, Meta Inc.|
|With increasing interest from MNOs/CSPs around converged IPoDWDM transport solutions, the MANTRA subgroup aims to define an end-to-end reference network architecture that is conducive to disaggregation. This also will align with the initiatives of MUST, a sister subgroup focused on accelerating the adoption of standard interfaces and data models for automating the management of complex Optical and IP networks.|
|14:40 – 15:10||PAM4 SR and AOC solution in HPC and data center – Yung Son, CTO and CMO, Optomind|
|Optomind’s advanced optical engine technology has enabled PAM4 112Gbps for QSFP112 and OSFP SR module and AOC using advance DSP as well as 56Gbps for QSFP56 and QSFP56-DD AOC using analog CDR to meet all the requirements including high performance, lowest power, and shortest latency. We achieved volume manufacturing with exceptionally high productivity and ultralow cost procurement.
Our innovative design implemented a self-alignment between the optical device and optical fiber without any high precision vision assembly machine that enhances productivity and reduces huge manufacturing cost.
Our PAM4 AOC is the best-in-class product, which is a key breakthrough in applications for higher performance computing (HPC) and advanced cloud data center including artificial intelligence and machine learning.
|15:20 – 15:50||Connectivity to You: The Importance of Quality and Reliability for Outside Plant Components, and the Role of Photonic Integration therein. – Erik Pennings, Business Development Director, ENSURE|
|Our goal is to get high-speed premium connectivity to everyone, and this centres to a good degree on the last mile, independent of whether this is to the home, business, datacentre, or cell site. The last mile will be increasingly fiber-based as well as passive, and given that the outside (access) plant is where most of the cost is, it is critical that passive components used here are of the highest quality and ultra-reliable. In this presentation it will be shown how ENSURE realised this, via their commitment to vertical integration, investing in the best premium equipment, and deploying photonic integration.|
|16: 00 – 16:30||Photonics based AI-service, which includes remote access to CogniFiber Aurora: a trainable classifier that operates at 100 million tasks/sec – Prof. Zeev Zalevsky, Cognifiber|
|We will describe the background, the need, the motivation and the IP, as well as the advantages of “pure-photonic computing” over other existing architectures and technologies|
Wednesday 21st September
|10:30 – 13:00||EPIC TechWatch at ECOC|
|10:30 – 10:45 Welcome and introduction by EPIC
10:45 – 12:30 Presentations:
Advanced Photonics Integrated Packaging Solutions Enabling the Next Generation Optical Connectivity – Carlos Viana, CEO at ICON Photonics
Photonics Packaging in Datacenter Focused Applications – Giorgio Cazzaniga, Director of Product Management by Jabil
Advanced Material Solutions for Packaged Optoelectronic Devices – Luca Mauri, Head of the Getters & Dispensers Development Laboratory at SAES Group
PHABULOuS – Fabrication Technologies for Free-form Optics – Ton Offermans, Technical Coordinator at PHABULOuS Pilot Line / CSEM
JePPIX: Scaling up InP PIC Production – Kevin Williams, Professor and Chair of the Photonic Integration research group at TU Eindhoven / JePPIX
PDKs of the Future: Enabling a Modular Design Ecosystem – Pierre Wahl, Co-founder & Global Sales Director at Luceda Photonics
Photonic Integration Based Devices for Tunable and Next Generation Networks Speaker – Francisco Rodrigues, CEO at PICadvanced
12:30 – 13:00 Networking
|13:10 – 13:40||112Gbps-PAM4 connectivity – different solutions for all applications – David Binder, Business Development Manager, Data Networking, Yamaichi Electronics|
|The market demands 112Gbps-PAM4 connectivity for pluggable modules. Yamaichi Electronics offers 112Gbps-PAM4 for: SFP, DSFP, NGSFP-DD, OSFP, QSFP, QSFP-DD, CFP and more. We have also available our modular mezzanine connector and our high-speed jumper cable interconnect product.
Product Focus speakers
Joost Verberk, Director of Product Management, Effect Photonics
Joost has made his career in product management, working for ENGIE before joining EFFECT Photonics where he leads the cross-functional product management team. He studied Electrical Engineering at the Eindhoven University of Technology and is currently enrolled in an Executive MBA at Kellogg WHU University. With his background and enthusiasm for technology, Joost loves working at pushing the boundaries of cutting-edge innovations, taking it from ideation to volume production.
Fady Masoud, Director, Solutions Marketing at Infinera
Fady Masoud is a Director of Solutions Marketing at Infinera. His area of expertise focuses on the architecture and requirements of next-generation optical networking infrastructure. During his 25 years in the telecommunications industry, Fady has held various positions in the optical networking domain at Nortel, Ciena and now Infinera. He started as a hardware test engineer on the first OC-192 (10 Gbps) systems and then as a Systems engineer on optical metropolitan products, all combined with hands-on experience. Fady holds a bachelor’s degree in electrical engineering from Laval University (Quebec City, Canada) and a master’s degree in systems technology (simulation of optical networks) from the Superior School of Technology (Montreal, Canada). He has written numerous publications, including books, on next-generation optical networking, including 100G, Data Center Interconnect, intelligent network evolution strategies and architecture, and on many other key topics.
Wilfried Noell, Director of research and development Justine Lullin, Project and Engineering manager SUSS MicroOptics
Hesham Taha, PhD, CEO Teramount Ltd.
Chris Pfistner Vice President, Sales & Marketing Avicena
Dr. Frank Smyth, Founder and CTO, Pilot Photonics Ltd Pilot Photonics
Frank Smyth is co-founder and CTO of Pilot Photonics Ltd, a scale-up company developing unique optical comb lasers based on photonic integration. His previous position was as co-founder and Executive Director of the CONNECT Centre for Future Networks at Trinity College Dublin for which he helped secure more than €40m in research funding from Science Foundation Ireland and from Industry. He graduated with a PhD from Dublin City University in 2009 having carried out pioneering research on novel tunable laser sources and optical switching systems. Frank has co-authored more than 95 research publications. He held a scholarship position at Bell Laboratories, Crawford Hill, New Jersey, and a research fellowship at Dublin City University before founding Pilot Photonics in 2011.
Carlos Pardo - CEO at KDPOF KDPOF
Mr. Pardo has served as a strategic profile manager in the microelectronics industry and with leading R&D teams. He has extensive knowledge in the high-tech silicon industry, as well as in both hardware and software development. Previously to founding KDPOF, He worked as a technical director in SIDSA managing R&D departments, development products, production, and customer support. Mr. Pardo also was part of Hewlett Packard SA Spanish as an R&D engineer for a variety of other business functions and DS2 (Design of Systems on Silicon SA).
Vincent Garnier, Director General FTTH Council Europe
Vincent Garnier is the Director General of the FTTH Council Europe since July 2020. In this executive capacity, Vincent manages and shapes the FTTH Council’s agenda and ensures the continuous implementation of its mission to advance ubiquitous full fibre-based connectivity to the whole of Europe. Vincent brings to this position 25 years of experience in the telecommunications industry, in Marketing and Business Development in EMEA and Asia for BtoB companies. Most recently he was Marketing Director responsible for defining the marketing strategies for the broadband solutions at CommScope, a global network infrastructure provider company. Prior to joining CommScope, Mr Garnier worked in international business development at TKH Group N.V. and as a Marketing Manager at Prysmian Group & Exide Technologies. Vincent Garnier has been actively involved in the FTTH Council Europe activities for several years. He became a Member of the Board of Directors and Treasurer in 2019.
Alfonso Domesi, EMEA Business Development Manager EXFO
Alfonso Domesi started his career in the telecommunications market in 1991 as a hardware and software development engineer. Over the years, he has tracked the evolution of transmission technologies, from the voice frequency analog modem to the current G.fast and optical fibers interfaces. He currently holds the position of EMEA Business Development Manager, with a dedicated focus on assessing new markets and technologies for EXFO’s Physical Layer product portfolio.
Dr. James Pond, Distinguished Engineer Ansys
Raza Khan Senior Market Manager-Wireless Products, Signal Integrity Products Group Semtech Corporation
Raza Khan is Semtech’s senior market manager for Wireless Products in Semtech’s Signal Integrity Products Group with over 15 years of experience in the semiconductor industry. In his current role, he oversees the strategy, product line development and market development for integrated circuit (IC) solutions for optical transport needs within the wireless market. This includes the Tri-Edge™ 50G PAM4 product portfolio and ClearEdge® 25G product portfolio for the emerging 5G wireless market as well as the FiberEdge™ 10G product portfolio for the 4G wireless market. Mr. Khan holds a Bachelor of Science degree in Electrical Engineering from Western University and a double major Masters of Business Administration in Strategic Marketing and Management of Innovation and Technology (MINT) from McMaster University.
Dr Paul Brooks - director of product and technology support at VIAVI Solutions VIAVI solutions
Dr Paul Brooks - director of product and technology support at VIAVI Solutions VIAVI solutions
Arturo Mayoral López de Lerma, Telecom Infra Project Meta Inc.
Arturo Mayoral is Technical Program Manager for the Telecom Infra Project Foundation driving several project groups within the Open Optical and Packet Transport project in TIP. He received a Ph.D. degree in telecommunications engineering with his thesis Integrated IT and SDN Orchestration of multi-domain multi-layer transport networks, from the Universitat Politècnica de Catalunya (UPC), while it was at the Centre Tecnologic de Telecomunicacions de Catalunya (CTTC) as optical researcher till 2017. Then, he starts at Wipro Ltd as Technology Expert in Optical networking and SDN and later in 2019, became full employee of Telefonica GCTIO. In 2021 joined Meta Connectivity as Technical Program Manager for the Telecom Infra Project.
Yung Son, CTO and CMO, Optomind Inc.
Yung invented and developed very unique optical engine platform based on selfaligned optical assembly at Optomind. Currently he is doing technical marketing as well. Optomind is a global leader in advanced active optical cable (AOC) solution including 400/800Gbps PAM4 SR products. Yung holds over 40 patents related to optical interconnects. He holds a Ph.D. in Electrical Engineering from KAIST in Korea.
Erik Pennings, Business Development Director, ENSURE
As the Business Development Director for ENSURE, Erik Pennings uses his extensive knowledge and experience to help grow ENSURE’s Premium Connectivity business, particularly in North America and Europe.
Prof. Zeev Zalevsky Cognifiber
Prof. Zalevsky is a Full-professor and Dean of the Faculty of Engineering at Bar Ilan University. His research expertise involves biomedical optics, super-resolution, and electro-optical devices. He has published more than 450 peer-reviewed papers, 10 books, 30 book chapters, and around 100 patents. For his work and great service to science, he received many national and international scientific prizes. He is also a co-founder and technological leader in many successful start-up companies that originated from technologies commercialized from his lab. Together with Dr. Cohen in 2012, Prof. Zavlevsky began the promising research endeavor which explored the implementation of in-fiber neural networks, enabling de-facto light speed inference computing
David Binder, Product Manager Data Networking, Yamaichi Electronics Deutschland GmbH
David Binder joined Yamaichi Electronics in 2017 as Business Development Manager for Data Networking. In this position he works closely with our headquarter in Tokyo and supports our global sales team by developing new sales channels, strategies and price models. His professional background is radio frequency and optical-electronics, he worked with customers in electronic manufacturing (OEM’s and EMS), defence, aerospace, RF-broadcasting and the telecom industry. He holds a BSEE from a Swiss university of applied sciences and an executive MBA.