09:30 10:00 State of play of  FTTH roll out in Europe – Vincent Garnier, Director General, FTTH Council Europe
More than half of European households now have access to full fibre connectivity and we witness a surge in Public and Private investment in support of aggressive FTTH roll out plans. However a lot still has to be done to make sure our continent has the fibre infrastructure it requires to meet the challenges of a green and digital society. This review of FTTH roll out throughout Europe will be followed by a focus on the key challenges the industry will be facing in the years to come.
10:10 11:10 ECOC Exhibition Industry Awards Announcements
Hear the winners as they are announced – ECOC TV
11:20 11:50 Testing essentials for your MPO system – Alfonso Domesi, EMEA Business Development Manager, EXFO
Data center, 5G, broadband, and high-speed link deployments are driving the number of multifiber push-on connectors (MPOs) to optimize installation, opening the door to new issues.  Get insights into best practices for technicians testing MPO links, including the inspection of MPO connector endfaces; how to mitigate the impact of damaged or dirty multifiber connectors, and streamlined Tier-1 certification of MPO links. In addition to current technologies, testing standards and solutions, the discussion will also cover proper methods of procedure to minimize operational costs and wasted time.
12:00 12:30 The Opportunities and Design Challenges of Co-packaged Optics – Ansys
Silicon photonics is a proven technology for high-speed, low-cost, high-volume pluggable transceivers. However, as data speeds and power budgets become increasingly demanding, there is a market need for co-packaged optics. While initially driven by switching needs, co-packaged optics will enable many innovations, including disaggregated compute architectures. The design of these systems is immensely challenging and requires high performance electronic photonic design automation (EPDA) workflows, as well as solutions to complex multiphysics problems such as the thermal analysis of full 3D ICs with silicon photonic interposers. In this talk, I review the opportunities, challenges and design solutions of co-packaged optics.
12:40 13:10 Innovation in 5G Wireless IC Technology: Optical Front Haul Transport – Raza Khan  Senior Market Manager-Wireless Products, Signal Integrity Products Group, Semtech Corporation
IC technology innovation will form an important aspect to enable the 5G applications of the future. We discuss how such innovations are being enabled by semiconductor companies for the eco-system to adopt a 5G foundation that will lay the ground for 5.5G and 6G.
13:20 13:50 Beyond 800G pluggable – what challenges lie ahead for the ecosystem – Dr Paul Brooks – director of product and technology support, VIAVI Solutions
Beyond 800G pluggables are becoming an important theme, we see the early ramp of 800G clients and 400G coherent and now the industry must set out a path of an ecosystem beyond 800G. We give a T&M perspective of the challenges ahead to successful develop and ramp in a post 800G world!
14:00 14:30 Telecom Infra Project  – Open Optical and Packet Transport (TIP OOPT) : MANTRA Introduction – Speaker tbc, Meta Inc.
With increasing interest from MNOs/CSPs around converged IPoDWDM transport solutions, the MANTRA subgroup aims to define an end-to-end reference network architecture that is conducive to disaggregation. This also will align with the initiatives of MUST, a sister subgroup focused on accelerating the adoption of standard interfaces and data models for automating the management of complex Optical and IP networks.
14:40 15:10 Title tbc – Yung Son, CTO and CMO, Optomind
15:20 15:50 Title tbc – Shanghai Ensure
16:00 16:30 Photonics based AI-service, which includes remote access to CogniFiber Aurora: a trainable classifier that operates at 100 million tasks/sec – Prof. Zeev Zalevsky, Cognifiber
We will describe the background, the need, the motivation and the IP, as well as the advantages of “pure-photonic computing” over other existing architectures and technologies