13:10 | 13:30 | A Concept for Network Planning in Partially Disaggregated Open Optical Networks – Stefan Melin, Telia (Schweden) |
Partially disaggregated open optical networks are targeted and deployed by operators. How to implement planning and impairment validation in the SDN architecture is not well defined and requires more attention to reach maturity. Telia propose a high-level concept for implementation of planning. | ||
13:35 | 13:55 | Next-gen converged optical access for PON, HFC, 5G & Business Services – Harj Ghuman, Cox Communications |
Currently one of the hottest topics in the Cable industry is 10Gigabit bandwidth and beyond, and the convergence of two primary topologies, HFC and PON, becomes highly desirable. For operators, the key technical innovations to reach this goal include Long-reach PON to centralize OLTs, Seamless scalability to coherent technology, Wide-band transmission window to augment the fiber utilization. Such a converged optical access will not only reduce the cost, but also provide a scalable path to multi-wavelength PON as well as 100G-400G coherent PON. | ||
14:00 | 14:20 | SDN REQUIREMENTS FOR VENDOR AGNOSTIC PARTIALLY DISAGGREGATED NETWORKS – Edward James Echeverry Zuleta, Senior Technical Expert, Telefonica CTIO |
Vendor agnostic partially disaggregated networks require full standard capabilities at both Open Terminal (OT) and Open Line System (OLS) SDN controller. In this talk we are presenting a standard deployment in Telefonica International network based on a combination of TAPI 2.1.3 and Netconf/Yang/OpenConfig enabling multivendor interoperability and different vendor combinations at both OLS and OT. The architecture presented here and the SDN requirements to implement it are totally aligned with TIP-MUST group where Telefonica is actively collaborating with other operators around the world to define a vendor agnostic transport SDN architecture. | ||
14:25 | 14:45 | Compact Multi Lambda Fiber Coupling solutions for future Chip on board and Co-Packaged Optics applications – Dirk Götzl Manager RF Electronic , Huber + Suhner Cubeoptics AG |
Future solutions for 800G and 1,6T transceivers have high requirements for optical coupling and also brings new challenges. Co-Packaged optics or Chip on board engines need low loss, high performance and stable optics with a matched beam characteristic, especially for silicon photonics. As density of optical coupling is increasing, the size of components for coupling, multiplexing and demultiplexing is getting a very important parameter. Also sub-components needs to be set as close as possible to avoid loss in the electric path. In this session upcoming challenges for coupling and sub components are shown and different possible solutions are discussed. | ||
14:50 | 15:10 | 3D Sensing: Practical New Apps Beyond Handsets – Mark Lutkowitz, Principal, fibeReality, LLC |
From the beginning of the 3DS marketplace, the one application that has failed to get adequate attention is robotics, both consumer- and industrial-based devices. This 940nm component technology is absolutely essential to helping to achieve significant growth in robots, especially with the emergence of labor shortages. Other business cases that will be addressed in this session include automotive, such as in-cabin deployment, aerospace/avionics, as well as other potential use cases. Both business projections and a competitive analysis of the principal suppliers will be provided. Also, there will be a discussion of the prominent users of this gear. | ||
15:15 | 15:35 | 980nm VCSELs: New standard in automotive – Dr. Joseph Pankert, VP Product Management and Rubén Pérez-Aranda , CTO, KDPOF , TRUMPF Photonic Components |
Autonomous drive technology requires processing large amounts of data within cars. As a consequence, optical interconnects will be required to manage the data flow. The technology, as standardized in the IEEE803.2cz group, is based on multimode interconnects. Compared to datacenters, automotive requires a much wider range of operating temperatures (-40°C up to 125°C backside), and an interconnect length of only below 40m. The VCSEL wavelength choice is 980nm because of its superior robustness against wear-out and random failures. Moreover, 980nm fits to existing OM3 fibers with only limited dispersion loss. We present progress in developing a full 980nm interconnect. | ||
15:40 | 16:00 | Satellite Communication – Dr. Sanjai Parthasarathi, Chief Marketing Officer, II-VI Inc. |
Satellite Communication market is poised to take off and represents a major new opportunity for Optical Communications, primarily for Low Earth Orbit (LEO) connections both between satellites and with the ground stations. The driving forces underneath the booming growth of satcom are the decreased hardware and launch cost, and the huge investments not only from government but also from the private sector, with new entrants among start-ups and webscalers. The opportunity to leverage fiber communication technology for space applications require to address some key challenges to survive launch and to operate in the space radiation environment. On top of the reliability issues, specific performances in terms of optical power, dimensions and power dissipation will be discussed. Long and extensive experience together with vertical integration from materials to subsystems, can make the difference in providing the optimal solution for custom applications to pioneer the new space frontier. |
Stefan Melin, Telia (Schweden)
Harj Ghuman, Cox Communications
Harj Ghuman holds a MS graduate degree in Microwaves and Modern Optics from UCL (London) and has been working in the Cable industry for over 20 years. He is currently at Cox Communications as Principal Strategic Architect and is responsible for strategic optical access networks for residential and commercial services and investigating new technologies and solutions. He holds several patents and has authored numerous papers.
Edward James Echeverry Zuleta, Senior Technical Expert, Telefonica CTIO
Dirk Götzl Manager RF Electronic , Huber + Suhner Cubeoptics AG
Dirk Götzl joined Huber+Suhner 2011 as Manager RF Electronic. He is involved as R& D engineer and project leader in different projects for optical and optoelectronic subassemblies for transceivers. For the development of subassemblies new MSAs, standards and form factors are one of his main topics to follow the newest developments in the Fiber Optics industry. He holds the Diploma in Radio Frequency of the Karlsruhe Institute of Technology.
Mark Lutkowitz, Principal, fibeReality, LLC
Mark Lutkowitz, Principal and co-founder of fibeReality, LLC, has 40 years of experience as a consultant, gathering and analyzing worldwide intelligence on optical components and systems, including in telecommunications, datacom, consumer, automobile, and other businesses. With an intense concentration on demand-side, primary research, he is one of the most objective, no-nonsense analysts in the industry. Mark has consulted to some of the largest manufacturers in the world and has authored countless studies. His blog articles have set a new standard for comprehensive and thought-provoking insights in the optics space. Mark is also an international expert on the 3D sensing/VCSEL marketplace.
Dr. Joseph Pankert, VP Product Management and Rubén Pérez-Aranda , CTO, KDPOF , TRUMPF Photonic Components
Dr. Sanjai Parthasarathi, Chief Marketing Officer, II-VI Inc.
Sanjai Parthasarathi joined II-VI in 2013 and has been the Chief Marketing Officer since 2019. Previously, Dr. Parthasarathi was Vice President, Product Marketing and Strategy, for II-VI Photonics since 2015. Prior to II-VI, he served as Senior Director, Product Line Management, at Oclaro. Over 30 years of broad management and technical experience, Dr. Parthasarathi has held a variety of progressive roles in R&D, manufacturing, product line management, and marketing, including senior business and technical management positions at Avanex Corporation, Oplink Communications, TeraStor, Western Digital, and Concurrent Technologies Corporation. Dr. Parthasarathi graduated from the Indian Institute of Technology, Madras, with a B.S. degree in Mechanical Engineering, and holds an M.S. in Mechanical and Aerospace Engineering from the University of Virginia and a Ph.D. in Engineering Science from the Pennsylvania State University.