Monday 7th December – Morning Session
12:20 – 13:00
Telecom Infra Project
The TIP Disaggregated Optical & Transport Network.
Speakers: Víctor López Álvarez – Telefónica, Stephan Neidlinger – Adva, Diego Mari Moretón – Facebook, Anders Lindgren – Telia Company, Gert Grammel – Juniper Networks
This backhaul project group at TIP works on the definition of open technologies, architectures and interfaces in Optical and IP Networking. It concentrates on different parts of the Transport network architecture, including optical transponders, line systems, IP access devices, open APIs and network simulation and planning tools. Hear from a panel of operators and vendors about the various parts of the stack that may include disaggregated cell site gateways, an open-source multi-vendor tool for optical network planning and operator use cases in open converged packet and optical networks.
13:00 – 13:20
AI-aided DSP design for coherent optical networks
Speaker: Dr. Maxim Kuschnerov, Director of the Optical and Quantum Communications Laboratory
Signal processing for optical modems developed at tremendous speed in the last decade, although its design was mostly driven by classical approaches combined with human intelligence. Currently we are seeing a paradigm shift in DSP design by incorporating artificial intelligence using deep learning for components like constellation shaping or advanced equalization. While the possibilities are vast, the computation demand for AI & deep learning can be excessive and needs to be considered in the context of a slowing Moore’s Law. Thus, the tools for using deep learning in optical DSP ASICs will have to evolve from today’s design methodology in order to accommodate the necessary next level of complexity.
13:20 – 13:40
The new roles of Optical and Packet networks with the advent of 5G RAN architectures
Speaker: Antonella Sanguineti, Head of PL Optical Transport
The advent of 5G, the recent innovations in RAN architectures and densification trends have put new requirements on the Fronthaul, Access and Metro optical and packet networks. Are the existing network ready to cope with the new wave? Changes are not only driven by the capacity increase, but by a completely new role that transport networks have to concur in the Radio transmission performances and overall network TCO. Is technology ready? What are the key ingredients for a smooth migration to the new transport paradigms?
13:40 – 14:00
CommStar Space Communications, LTD, UK
The Next Giant Leap in Space Communications: Cislunar
Speakers: Robert H Brumley, Founder, Chairman
It is estimated that over 30 private companies have invested capital in a wide variety of business plans to support humankind’s return to the Moon. This estimate does not include the national space programs of NASA (Artemis) and ESA (ARTES, Lunar Gateway). Whether lunar landers, mining operations, advanced habitations, or other creative commercial and scientific ventures, all have at least one thing in common – need for robust, state-of-the-art communications. Whether Direct to Earth, or Bi-Directional, lunar pathfinders, pioneers, and developers will need to stay in touch with support facilities on the Earth. CommStar-1, the World’s 1st commercial hybrid (RF & Optical) data relay satellite, www.commstar.space, is designed solely for that purpose – connecting the Earth and the Moon by 2023 with robust, reliable data communications. CommStar-1 would like to share its plans and findings underlying this exciting new venture with the ECOC membership.
Monday 7th December – Afternoon Session
16:00 – 16:20
Automation and Autonomous Network solution in Cloud Native architecture: user stories and practical examples of deployment
Speaker: Domenico Di Mola, VP of Engineeering
16:20 – 16:40
Paving the way for plug and play: Management and control of coherent optical pluggables
Speaker: Ian Alderdice, Software Lead, Ciena Optical Microsystems
Management interfaces are the glue between plug and host platform and they pre-date the emergence of coherent technology in pluggable form factors. The enhancements in link performance, operational ease of use and advanced telemetry that coherent technology offers for optical networking has meant upgrades were needed for coherent pluggable management interfaces. Considerations for both hardware and software aspects were required to define the OIF 400ZR C-CMIS, or Coherent-Common Management Interface Specification. As coherent pluggables become more feature-rich and complex, the ability to support multi-vendor interoperability, seamlessly integrate them into host platforms and provision optical links is going to place still further demands on the specification of management interfaces. This session reviews the evolution of optical modules, introduces the progress made with C-CMIS to date and how it will apply to real-world deployments of 400ZR, as well as exploring the challenges ahead for defining the next generation of coherent pluggable management interfaces.
16:40 – 17:00
Optical Intelligence: Path to Network Operations Enhancement and Automation
Speaker: Dr. Christopher Janz, Technical Vice President & Director, Optical Systems Competency Centre
Increased instrumentation of the optical network, combined with extensive transmission performance modeling, is opening the path to more robust network performance, improved resource utilization and automation. We review advances in instrumentation, optical modeling and management-control and planning platforms, highlighting leading use cases and the resulting operator gains.
17:00 – 17:20
A Path to Next Generation Coherent
Speaker: Tom Williams, Vice President of Marketing
Today’s coherent solutions address a wide range of applications from the network edge to submarine. Embedded modules designed for multi-haul applications utilize common hardware and programmable DSPs with flexible shaping features and performance that approaches the Shannon limit. Pluggable coherent implementations tend to be more optimized for power and density to address higher volume market segments. In edge and metro applications, architectures based on these two approaches compete with one another. Some believe broader adoption will drive pluggable coherent solutions toward longer reach applications, as well. The presentation will look at these trends and discuss how it impacts development of next generation coherent solutions.
17:20 – 17:40
2020 OIF Transport SDN API Interoperability Demo
Speaker: Arturo Mayoral Lopez, Ph.D., Technology Expert, Transport Networks, Global CTIO, Telefonica
Learn how OIF and member network operators are accelerating the commercialization of transport SDN worldwide and transport network transformation for the 5G era with this latest interoperability demo.
Hear about the findings of the demo that brought new use cases and deployment scenarios into Telefonica’s lab to test multi-vendor interoperability of Layer 1 OTN, Layer 0 OTN control using ONF T-API 2.1.3 and OpenConfig device APIs.
Understand how open Transport SDN APIs:
- Improve network agility to adapt to dynamic service demands and traffic patterns
- Improve service provisioning and time-to-revenue
- Reduce maintenance and management with simplified control and automation
18:00 – 18:20
LightCounting Market Research
The COVID-19 Pandemic has Accelerated the Adoption of Cloud Services
Speaker: Dr. Vladimir Kozlov, Founder and CEO
Investments by Cloud companies in mega datacenters and their supporting networking infrastructure have created a new and very dynamic segment in the optical components and modules market.This presentation will detail the impact of Mega Datacenters on the market for Ethernet optical transceivers, DWDM optics, Active Optical Cables (AOCs) and Embedded Optical Modules (EOMs). It will leverage extensive historical data on shipments of these products, combined with market analyst research, to make projections for the market in 2020-2025. The presentation will provide an overview on historical shipments data and projections for 2.5G, 10G, 100G, 200G, 400G DWDM ports and several types of AOCs/EOMs.
Tuesday 8th December – Morning Session
12:00 – 12:20
IHP GmbH – Innovations for High Performance Microelectronics, Leibniz-Institut für innovative Mikroelektronik
Title: EPIC Foundry Services for Data Center Interconnect Applications
Speaker: Prof. Lars Zimmermann
SG25H5_EPIC is an advanced monolithic electronic photonic integrated circuit (EPIC) technology co-integrating silicon photonics with high-performance BiCMOS electronics. A major application of this technology is in datacenter interconnects. Important features of the latest generation technology will be presented, such as passive optical building blocks design libary, high-speed germanium detectors, and high-speed depletion type phase shifters. In addition, sample circuits will be presented demonstrating performance characteristics of photonic BiCMOS based optical sub-assemblies. The technology will be presented in the context of IHP’s overall technology portfolio including SG13G2 (ft=300/fmax=500) and the upcoming enhancement of SiGe:C BiCMOS performance with world record bipolar performance.
12:20 – 12:40
A paradigm shift in the optical communication market – from Transceivers to Highly Integrated Co-package Optics enabled by Silicon Photonics
Speaker: Sven Otte, Chief Executive Officer and Co-Founder
The era of exponential data growth driven by mobile broadband has just started which generates new technical and business requirements for optical component vendors. In the past 20 years the optical communication market did undergo an evolutionary development in which data rates in the optical domain increased from 10Gb/s to 100Gb/s. Nevertheless, the fundamental partitioning of the market, i.e having an ecosystem where vendors either supply components, transceivers, subsystems and or systems remained mostly intact. Recognizably the electrical data rate has been kept at 50Gb/s so far and research shows that increasing the electrical data rate to 100Gb/s creates challenges in terms of signal integrity and power. Those challenges may lead to a paradigm change in the sense that the current four level ecosystem may collapse to two or three level. In this talk we will provide an overview about the challenges and why monolithic integrated silicon photonic is indispensable to address them.
12:40 – 13:00
Narrow linewidth tunable lasers based on hybrid assembled Photonic IC technology
Speaker: Douwe Geuzebroek, VP Marketing and Sales
Narrow linewidth and tunable lasers have a broad range of application both inside data and telecommunication as well as in sensing. We will discuss how hybrid assembled lasers based on a photonic integrated circuits in silicon-nitride technology allow for record low linewidths, while being tunable over the C-band or even beyond. The photonic integration technology allows to include application specific functionality as well, creating a fully integrated components, that is robust and compact. The use of silicon-nitride even allows for applications outside of the 1550nm range.
13:20 – 13:40
Industry’s First Unified Electronic and Photonic Design Platform
Speaker: Twan Korthorst, Director Photonic Solutions
This talk will introduce Synopsys’ OptoCompiler solution for photonic integrated circuit (PIC) design, layout implementation and verification. OptoCompiler is the industry’s first unified electronic and photonic design platform, combining mature and dedicated photonic technology with Synopsys’ industry-proven electronic design tools and methods to enable engineers to produce and verify complex PIC designs quickly and accurately. By providing schematic-driven layout and advanced photonic layout synthesis in a single platform, OptoCompiler bridges the gap between photonic experts and IC designers to make photonic design accessible, fast, and flexible.
13:40 – 14:00
Go to market faster by building Photonic ICs the way you build software
Speaker: Dr. Martin Fiers, Product Manager & Co-founder,
In the last 10 years, new platforms and tooling in software development have changed the way building software happens. What can we learn from this when we build photonic integrated circuits? In this presentation we’ll look at how a code-centric design flow for PIC looks like. We’ll explain how we can borrow techniques from software development to manage design complexity and deal with uncertainty, and go to market faster.
14:00 – 14:20
3D Wafer-Level Microoptics For Ultrafast Optical Fiber Communications
Speaker: Carlos Viana, CEO and Jean-Luc Polleux
The next generation ultrafast optoelectronics imply smaller active areas and thus complex assembly and active alignment techniques. High performance and low-cost fiber-to-device coupling is an outstanding challenge. A main question stands – Can we simplify our photonics packaging? Can we make the optical coupling easier and accessible to most? Can we keep shrinking down the active device sizes to go beyond MMF/SMF 56Gbps or 112Gbps+ transmission per channel? A novel technology emerged from ICON Photonics startup company in France with wafer-level 3D polymer microoptics technology that is addressing this challenge offering a passive and simple alignment method.
Tuesday 8th December – Afternoon Session
16:00 – 16:20
EO Polymer modulator platform with enhanced stability at both 1.3um and 1.5um
Speaker: Michael Lebby, CEO
EO polymer modulators are now poised to impact data heavy applications such as datacenter networks and high performance computing at 1.3 um wavelengths as well as 1.5 um telecom applications. Prior EO polymers have been designed for 1.5 um wavelength, matched to the traditional application of modulators to long distance fiber optical communications. At today’s higher speeds, even 1.3 um applications now require external modulators.
The talk will discuss the latest results on stable EO polymers whose operating range has been extended for the first time to include 1.3 um through advanced polymer engineering. The essence of designing a chromophore-host EO polymer that is low loss, stable, with high r33 at 1.3um and 1.5um opens up opportunities for low power consumption direct driving of modulators without the use of dedicated (and expensive) driver chips. With high speed and low power capability, MZ modulators that exceed 70GHz optical analogue EO S21 with low voltage drive can alleviate bottlenecks anticipated for 400Gbaud plus data rates in current network equipment.
This talk will also review the latest work in photonics roadmaps (IPSR – International Photonics Systems Roadmap process, 2020) that look out towards 1600 and 3200 Gbps aggregated data rates, and multi-Tbps optical switching solutions, and how these challenges can be addressed by polymer-based technologies.
16:20 – 16:40
Silicon photonic chiplets for chip-to-chip communications
Speaker: Dr. Mark Wade, President, CTO, Co-Founder
Recent applications in machine learning and artificial intelligence have accelerated the demand for chip-to-chip bandwidth. However, electrical I/O solutions face severe challenges in meeting the required density, power, and reach requirements needed to build next-generation systems. In this talk, we will present advancements in building a new generation of chiplet technologies that result in multi-terabit/s per chiplet capabilities, <5pJ/bit energy efficiency, and the ability to span centimeters to kilometers in reach. Additionally, we present an overall chip-to-chip communications architecture featuring remote laser sources and discuss the impacts on next-generation computing systems.
16:40 – 17:00
800G Datacenter Optics
Speaker: Andreas Bechtolsheim, Chairman, Chief Development Officer and Co-Founder
800G Optics based on the 100G Serdes and 100G Lambda will be ramping to volume production next calendar year, offering significantly better cost-performance,power efficiency and two times the density of 400G optics modules. This talk discusses the importance of transitioning to 100G Lambda and Serdes which will be the highest volume ecosystem over the next 10 years, and current expectations on timing for 200G Lambda optics.
17:00 – 17:20
Title: Datacenters: Optics in Cloud Computing
Speaker: Supriyo Dey, VP of Product Line Management and GM Data Centre Buisness Unit
With the explosive growth of mobile services, optical transmission, and cloud computing for inter- and intra- datacenter traffics, Ethernet data rates have been increasing rapidly. Optical transceivers capable of supporting 400Gb/s have become commercially available. One critical area affecting optical connectivity requirements is for the scenarios of transmission distances of 2-40km. Source Photonics will review the evolving state of proliferate 400G technologies for these applications and the requirements such technologies should meet. We will look into 100G optics which are currently being deployed in volume for 100G LR4, ERL4 and ER4, and also compares the technologies available for even up to 80km. At 400Gb/s, we’ll examine the performance trade-offs between LR8 and LR4 for 10km, and among ER8 vs. ER4 vs. ZR1 for 40km-like distance. Finally, we will review how to apply these well-established 4/8-lane optics packaging for emerging 800G and/or 1.6Tb/s applications such like 2xFR4 and LR8.
17:20 – 17:40
Lessons learned from the first 5G mobile network deployments
Speaker: Guillaume Lavallee, Product Line Manager,
Installation and maintenance of the fiber infrastructure will be critical for the success of 5G mobile networks. Existing fiber infrastructure will need to be leveraged as a critical path to 5G, and aging fiber networks will need to support a mix of optical technologies, such as PON and DWDM. In addition, networks are becoming denser in order to accommodate increasing cellular capacity and coverage mandated by 5G. This paves the way for massive small cell deployments requiring more fiber in more places and the potential for more issues. The aim of this session is to present strategies for accelerating 5G fiber rollouts and delivering stringent quality of service (QoS) performance results, while maximizing ROI.
17:40 – 18:00
400ZR – From Concept to Reality
Speaker: Josef Berger, AVP Marketing, Optical Interconnect,
Driven by exponential growth in DCI capacity, the industry demanded drastically lower cost and power consumption. End users demanded interoperability and pluggability for ease of use and supply chain security. OIF, alongside its members and leadership, worked relentlessly to create a multi-vendor, interoperable coherent interface to meet the needs of the industry. In 2016, the 400ZR effort was born to offer data center operators an interoperable, cost-effective approach to support DCI links at greater than 100 Gbps. This presentation will provide an overview of the development efforts in the industry thus far and explore what it takes to make deployments successful.
18:00 – 18:20
Title: Building Blocks for 800G, Co-Packaged Optics, and Beyond
Speaker: Karl Gass, OIF Physical & Link Layer Working Group – Optical Vice Chair
OIF is promoting interoperability on multiple interface building blocks to enable next generation architectures for compute, DCI, metro and long haul networks. Building on previous success in electrical, optical, and protocol interfaces, we present our newest work on 224 Gbps electrical interfaces, 800ZR interoperable coherent standards, and co-packaging of optical engines with associated silicon networking devices. These advancements will significantly impact networks of the future, enabling the industry to keep up with growth demands for more bandwidth, increased optimization of power consumption and improvements in bandwidth-density. Learn how the technical challenges of these three areas are viewed as significant hurdles requiring industry-wide collaboration for effective next generation networks.
18:20 – 18:40
Compound Semiconductors and Engineered Materials Enabling Advances in Biomedical Optics
Speaker: Sanjai Parthasarathi, CMO
Engineered Materials and Compound Semiconductors are enabling advances in biomedical optics for various segments and applications within life sciences. Diagnostics is one such critical application that is especially important in the age of COVID. Engineered materials and compound semiconductors are the foundation of many components that play a critical role in COVID-19 diagnostics. This talk will address the market drivers and trends, as well as discuss how material platforms and technologies originally developed for optical communications applications are now front and center of biomedical optics including the fight against COVID.
Wednesday 9th December – Morning session
12:00 – 12:20
Evolution of Form Factors (for pluggable transceiver modules) from a connector maker’s perspective
Speaker: David Binder, Business Development Manager
Form Factors for pluggable transceiver modules have evolved with increasing data rates. Yamaichi Electronics has provided the leading designs for connectors to several MSAs: CFP2, CFP4, CFP8 and DSFP. We would like to share our idea of advantages of form factors in terms of density, thermal and data rate – from a connector maker’s perspective. Despite all evolution, pluggable modules might be replaced by other approaches in the future. E.g. On board optics, Co-packed optics, etc. We’d like to share our vision on how a connector maker tries to shape its development road map to overcome the post pluggable era.
12:20 – 12:40
Huber+Suhner Cubeoptics AG
100G, 400G. 400+G and 800G transmission standards
Speaker: Dirk Götzl, RF Electronic
For 100G, 400G and beyond many different standards and MSAs have been proposed in the last years. Up to now more than 30 different standards and MSAs have been published and new standards will be published in near future, making it difficult to have an overview.
In the session we would like to give an overview over existing and future standards, as well as the activities of the different MSA groups.
Regarding future standards we want to show which trends will be very important in the near future and will effect which standards and MSAs will get most important.
Wednesday 9th December – Afternoon session
16:00 – 16:20
Execution and deployment challenges in 400G ecosystem (SP and DC) and road map evolution towards 800G and different solution (pluggable, on board, co-package)
Speaker: Jeff Maki, Distinguished Engineer-II
16:20 – 16:40
Test and validation of pluggable digital coherent optics
Speaker: Paul Brooks, Director, Lab and Production Strategy
Pluggable digital coherent optics are emerging for 400G class interconnect. With applications in both telecoms and now enterprise applications such as data center interconnect (DCI) wide spread deployment in a multi-vendor ecosystem will drive a healthy new challenges in test and validation. The presenter draws upon VIAVIs experience in test and validation of coherent pluggable modules and delves into the new challenges posed by 400G including DSP, module management and high speed electrical interfaces. The module complexity combined with aggressive price expectations and the requirements of an open, standards based ecosystem mean a new approach to test is critical to enable pluggable coherent optics to reach their market potential
16:40 – 17:00
Driving a New Industry Standard for Optical Laser Sources to Advance AI, Data Center Efficiency, and other Advanced Applications of Optical Interconnect
Speaker: Chris Cole, Chair, CW-WDM MSA; Advisor, II-VI Incorporated
Today’s high volume datacom optics defined by IEEE and MSA standards specify serial or four WDM interfaces. Emerging advanced integrated optics applications, such as silicon photonics-based high-density co-packaged optics, optical computing, and AI, are expected to move to 8, 16, and 32 wavelengths. In this talk, we will discuss how standardizing higher wavelength counts in the O-band is a crucial part of an emerging ecosystem and the progress being made by the MSA to generate a set of specifications that will enable developers to choose what is optimum for their application, while allowing laser suppliers to invest in one technology platform.
17:00 – 17:20
The role of optical fiber: On its 50 year anniversary what has changed?
Speaker: Roshene McCool, Market and Technology Development Manager
Optical transmission systems continue to evolve to meet the bandwidth needs of the modern world, but the attributes of the underlying fiber infrastructure remain critical for success. In this talk we will explore the fundamental attributes of fiber in the context of modern optical transmission systems. We will describe the continued importance of fiber parameters, such as, attenuation, chromatic dispersion, macrobend resilience and compatibility with other fiber types, while exploring the increasing relevance of other attributes in the context of new and emerging network technologies and applications.
17:20 – 17:40
Ethernet for 5G fronthaul and Open RAN: key for network evolution
Speaker: Sebastien Prieur, Product Line Manager
5G network evolution – from distributed to centralized and virtualized RANs – is driving more stringent transport and protocol requirements for latency, synchronization, quality of service (QoS) and other criteria, forcing operators to rethink their fronthaul strategy to meet these challenges. How is Ethernet evolving to address new 5G requirements, what role do Time Sensitive Networking (TSN) and network slicing play in this service environment and how are standards, such as eCPRI and Open RAN (O-RAN) shaping the landscape. We will explore these compelling questions and address test and integration strategies for maximizing the benefits of 5G deployments.
17:40 – 18:00
Evolution of Cable Optical Access Networks
Speaker: Alberto Campos, PhD
Cable optical access evolution is driven by the ever-increasing traffic demand, greater number and diversity of services supported as well as demand on greater reliability and low latency. The implications of cable’s access network transformation on optical transport technologies and network architectures are reviewed. Network management requirements of the evolved optical access network as well as wireless-wired network convergence considerations are also presented. A focus area is the increasing role that coherent optics will play in cable’s optical access and the opportunities of these emerging use cases for the telecom and data center industries.