12:0012:20Utilizing foundries to scale hybrid electro-optic polymer modulators
Dr. Michael Lebby, CEO  and Dr. John Zyskind, VP Engineering, Lightwave Logic Inc
Electro-optic polymer modulators are now becoming a hot topic in the industry as it strives to increase modulation speed while reducing   optical network equipment power consumption.  As the polymer material requires no special fabrication tooling, and can be in spun onto silicon wafers, the technology is ideally suited for volume scale foundry processes in semiconductor fabs with standardized PDKs (process design kits).  This allows the polymer to be additive to any semiconductor wafer platform including Silicon photonics and Indium Phosphide (InP).  Furthermore, polymer modulators are small enough to fit easily into pluggable transceiver modules and, by virtue of the ultrafast speed of the physics of electro-optic polymers, have the potential to enable the multi-Tbps aggregated data-rates that the industry will need. .       The talk will discuss the latest results on foundry fabricated stable and reliable EO polymers for integrated photonics platforms.  Device demonstration will show electro-optical and electrical 3dB bandwidths that are in excess of 70 and 100GHz.  The electro-optical materials have competitive performance characteristics both at 1310nm as well as 1550nm operating wavelengths.  Reliability and stability results will be presented to show the robustness of the technology platform.    This talk will also review the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level.  The roadmaps are a working, living document that helps plot out PIC platform challenges, opportunities, and directions for a broad portfolio of stakeholders over the next decade.  The roadmaps review next generation aggregated data rates into the 10s of Tbps (1.6, 3.2, 6.4 12.8 etc.), and more specifically, how these challenges can be addressed by polymer-based technologies.
12:2512:45Silicon Photonics Technologies Supporting Wide Range of Telecom and Data Center Applications
Rang-Chen Yu, Sr. Vice President, SiFotonics Technologies
Silicon photonics had been gaining momentum as main stream optical networking technologies for high data rate applications, especially for hyper scale data centers. In this talk, we will present optical transceiver module solutions with silicon photonics for wider scale applications covering 5G mobile xHaul, next generation PON, as well as metro, and data center applications.  Foundational silicon photonics platforms such as Ge/Si APD, coherent integrated photonics circuits, and high channel count IMDD PICs will be discussed in the context of supporting these solutions to meet broader requirements of low power, low cost, small size, extended temperature operations. Examples of transceiver solutions uniquely addressing these broad applications will also be discussed.
12:5013:10Thin-film Lithium Niobate, a commercially viable, scalable, and low power modulator solution for high-speed applications
Christian Reimer, PhD  Head of Product, Co-Founder, HyperLight Corporation
A key challenge for the optical communications industry is to address the growing power consumption problem in the communication networks. Various power reduction schemes are being explored including advanced modulator material such as thin-film lithium niobate (TFLN). The new modulation technologies that can reduce optical loss and the required electrical RF power have the potential to serve as drop-in solutions without infrastructure changes. Remarkably, recent demonstration of replacing the modulators inside an 800G DR8 module with TFLN has already resulted in a 20-30% power reduction compared to silicon-based solutions. In this talk, we will highlight the advantages of the TFLN solutions and discuss the scalability and commercial viability of this high-speed and low power integrated platform.
13:1513:35Low loss PICs: From fast prototyping to high volumes
Michael Geiselmann, Managing Director, LIGENTEC
Propagation losses in PICs are very important to have energy efficient on chip routing and are especially crucial if already very few photons are there to start with. In this webinar we will give an overview of LIGENTEC’s low loss PICs based on silicon nitride and application areas in LiDAR, Quantum and sensing. We explain our Process Design Kit and different fabrication modules. Reproducibility and uniformity are of critical importance and are addressed with statistical process control in our 100mm and 200mm wafer fabrication.
13:4014:00High-speed testing for PICs
Iñigo Artundo, CEO, VLC Photonics (a Hitachi group company)
Characterization and testing of photonic integrated circuits (PICs) still presents one of the largest challenges for the industry, given the relatively low yields still found in photonic manufacturing and the large costs from packaging non-good dies. Large volume applications like telecom and datacom transceivers require scalable and low-cost approaches for photonic wafer level testing, although there is currently a debate whether if high-frequency testing is also required or not, and at what point. This presentation will review the current state-of-the art in opto-electronic probing, measurement instrumentation, and techniques for reliable and high-speed testing.
14:0514:25Advanced InP DFB Laser Sources for Silicon Photonics Hybrid Integration
Andy McKee,  CTO, Sivers Photonics
There is increasing demand for multi-wavelength CW Indium Phosphide DFB laser array sources supporting ultra-high external modulation formats around 1300nm. The CW-WDM MSA has driven standardisation in this area and we will report on the latest developments including optimised laser design, wafer fab process technology trends, device parametric performance and reliability.
14:3014:50Fibre Innovations for Scale and Sustainability
Roshene McCool, Senior Market & Technology Development Manager, Corning Incorporated
Network capacity is increasing at an unprecedented rate. Whilst capacity increases are placing pressure on the limits of optical transmission performance the industry looks to means of delivering multiple optical pathways using the passive medium of optical fiber. This talk will discuss how optical fiber and cable are evolving to deliver capacity with highly parallelized solutions from the data center to submarine applications.

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