12:00 | 12:20 | Utilizing foundries to scale hybrid electro-optic polymer modulators Dr. Michael Lebby, CEO and Dr. John Zyskind, VP Engineering, Lightwave Logic Inc |
|||
Electro-optic polymer modulators are now becoming a hot topic in the industry as it strives to increase modulation speed while reducing optical network equipment power consumption. As the polymer material requires no special fabrication tooling, and can be in spun onto silicon wafers, the technology is ideally suited for volume scale foundry processes in semiconductor fabs with standardized PDKs (process design kits). This allows the polymer to be additive to any semiconductor wafer platform including Silicon photonics and Indium Phosphide (InP). Furthermore, polymer modulators are small enough to fit easily into pluggable transceiver modules and, by virtue of the ultrafast speed of the physics of electro-optic polymers, have the potential to enable the multi-Tbps aggregated data-rates that the industry will need. . The talk will discuss the latest results on foundry fabricated stable and reliable EO polymers for integrated photonics platforms. Device demonstration will show electro-optical and electrical 3dB bandwidths that are in excess of 70 and 100GHz. The electro-optical materials have competitive performance characteristics both at 1310nm as well as 1550nm operating wavelengths. Reliability and stability results will be presented to show the robustness of the technology platform. This talk will also review the latest work in photonics roadmaps on both the integrated photonics (PIC) level as well as PIC packaging level. The roadmaps are a working, living document that helps plot out PIC platform challenges, opportunities, and directions for a broad portfolio of stakeholders over the next decade. The roadmaps review next generation aggregated data rates into the 10s of Tbps (1.6, 3.2, 6.4 12.8 etc.), and more specifically, how these challenges can be addressed by polymer-based technologies. | |||||
12:25 | 12:45 | Silicon Photonics Technologies Supporting Wide Range of Telecom and Data Center Applications Rang-Chen Yu, Sr. Vice President, SiFotonics Technologies |
|||
Silicon photonics had been gaining momentum as main stream optical networking technologies for high data rate applications, especially for hyper scale data centers. In this talk, we will present optical transceiver module solutions with silicon photonics for wider scale applications covering 5G mobile xHaul, next generation PON, as well as metro, and data center applications. Foundational silicon photonics platforms such as Ge/Si APD, coherent integrated photonics circuits, and high channel count IMDD PICs will be discussed in the context of supporting these solutions to meet broader requirements of low power, low cost, small size, extended temperature operations. Examples of transceiver solutions uniquely addressing these broad applications will also be discussed. | |||||
12:50 | 13:10 | Thin-film Lithium Niobate, a commercially viable, scalable, and low power modulator solution for high-speed applications Christian Reimer, PhD Head of Product, Co-Founder, HyperLight Corporation |
|||
A key challenge for the optical communications industry is to address the growing power consumption problem in the communication networks. Various power reduction schemes are being explored including advanced modulator material such as thin-film lithium niobate (TFLN). The new modulation technologies that can reduce optical loss and the required electrical RF power have the potential to serve as drop-in solutions without infrastructure changes. Remarkably, recent demonstration of replacing the modulators inside an 800G DR8 module with TFLN has already resulted in a 20-30% power reduction compared to silicon-based solutions. In this talk, we will highlight the advantages of the TFLN solutions and discuss the scalability and commercial viability of this high-speed and low power integrated platform. | |||||
13:15 | 13:35 | Low loss PICs: From fast prototyping to high volumes Michael Geiselmann, Managing Director, LIGENTEC |
|||
Propagation losses in PICs are very important to have energy efficient on chip routing and are especially crucial if already very few photons are there to start with. In this webinar we will give an overview of LIGENTEC’s low loss PICs based on silicon nitride and application areas in LiDAR, Quantum and sensing. We explain our Process Design Kit and different fabrication modules. Reproducibility and uniformity are of critical importance and are addressed with statistical process control in our 100mm and 200mm wafer fabrication. | |||||
13:40 | 14:00 | High-speed testing for PICs Iñigo Artundo, CEO, VLC Photonics (a Hitachi group company) |
|||
Characterization and testing of photonic integrated circuits (PICs) still presents one of the largest challenges for the industry, given the relatively low yields still found in photonic manufacturing and the large costs from packaging non-good dies. Large volume applications like telecom and datacom transceivers require scalable and low-cost approaches for photonic wafer level testing, although there is currently a debate whether if high-frequency testing is also required or not, and at what point. This presentation will review the current state-of-the art in opto-electronic probing, measurement instrumentation, and techniques for reliable and high-speed testing. | |||||
14:05 | 14:25 | Advanced InP DFB Laser Sources for Silicon Photonics Hybrid Integration Andy McKee, CTO, Sivers Photonics |
|||
There is increasing demand for multi-wavelength CW Indium Phosphide DFB laser array sources supporting ultra-high external modulation formats around 1300nm. The CW-WDM MSA has driven standardisation in this area and we will report on the latest developments including optimised laser design, wafer fab process technology trends, device parametric performance and reliability. | |||||
14:30 | 14:50 | Fibre Innovations for Scale and Sustainability Roshene McCool, Senior Market & Technology Development Manager, Corning Incorporated |
|||
Network capacity is increasing at an unprecedented rate. Whilst capacity increases are placing pressure on the limits of optical transmission performance the industry looks to means of delivering multiple optical pathways using the passive medium of optical fiber. This talk will discuss how optical fiber and cable are evolving to deliver capacity with highly parallelized solutions from the data center to submarine applications. |
Meet our speakers
Michael Lebby, CEO, Lightwave Logic
Michael S. Lebby joined Lightwave Logic as a member of the Board of Directors in 2015. In May 2018, Dr. Lebby assumed the role of CEO, Lightwave Logic Inc (LWLG:OTCQB) Dr. Lebby (born 1961, London, UK) is an Anglo-American entrepreneur and intrapreneur in the fields of optoelectronics/photonics electronics and semiconductors. Dr. Lebby’s career started with the British Government in 1977 in telecommunications and he did research at their research labs (RSRE Malvern) in the early 1980s. Dr. Lebby worked at AT&T’s research labs: Bell Labs (1985-1989) in photonics, and subsequently drove the development (and co-authored the first patent) of the oxide VCSEL diode laser at Motorola in the 1990s (which is now used in laser mice, 3D sensing/FaceID in mobile phones, optical interconnects; where volumes of the laser are over 1B units today). From 2005-2010 he led the USA trade association in optoelectronics (OIDA) and represented the optoelectronics and photonics industry on Capitol Hill. Dr. Lebby has run technical start-ups and commercialized optoelectronic and photonics technology into volume manufacturing. He is currently a technical expert to the European Commission. He is a Fellow member of IEEE and OSA, and has been voted PIC (Photonic Integrated Circuit) business leader of the year by the PIC International Conference in 2018. Dr. Lebby holds over 450 issued international patents in photonics and electronics, that have been derived from over 200 issued USPTO utility patents, mostly in the field of optoelectronics, photonics and semiconductors. He has been cited by the USPTO to be in the most prolific 75 inventors in USA from 1988-1997.
Dr. Rang-Chen Yu, Sr. Vice President, SiFotonics Technologies
Dr. Rang-Chen Yu is currently Senior Vice President of Sifotonics Technologies. Dr. Yu has been a key contributor to 100G Lambda MSA to promote new standards such as 100G ER1 and 400G ER4. Before joining SiFotonics, Dr. Yu was Vice President and General Manager of Optoelectronic Solutions business unit of Oplink Communications (Acquired by Molex). Prior to Oplink, Dr. Yu was Global Vice President for Source Photonics. He also served senior executive and management positions with Agility Communications and SDL (both acquired by JDSU). He earned his Ph. D. in Solid State Physics at University of Pennsylvania, and B. S. in Physics from Peking University.
Michael Geiselmann, Managing Director, LIGENTEC
Michael Geiselmann (Managing Director) studied physics and engineering at University Stuttgart and Ecole Centrale Paris. After his PhD at ICFO in Barcelona in 2014 he joined the laboratory of Prof. Kippenberg at EPFL in Lausanne, where he advanced frequency comb generation on integrated silicon nitride chips towards applications and was involved in several international research projects. In 2016, he co-founded LIGENTEC and brought the company to the international stage of photonic integration.
Iñigo Artundo, CEO, VLC Photonics (a Hitachi group company)
Iñigo Artundo obtained the M.Sc. in Telecom Engineering at the Universidad Publica de Navarra (Pamplona, Spain) in 2005, and received his Ph.D. in Applied Physics and Photonics at the Vrije Universiteit Brussel (Brussels, Belgium) in 2009. He has been involved in several national and European research projects and networks of excellence focused on optical telecom and interconnects, micro-optics and photonic integration. He has worked as a reviewer for several scientific journals, national and international funding agencies. He holds specializations in Business Financing, Commercial Management and Research, and Strategic Marketing. He is a member of IEEE, SPIE and COIT.
Andy McKee, CTO, Sivers Photonics
Dr Andrew McKee received a BSc (Hons) degree in Electronic Engineering and a Ph.D. from the University of Glasgow. His research was in the area of Quantum Well Intermixing (QWI) of InGaAsP MQW structures for Photonic Integrated Circuits. Andrew has extensive experience in all aspects of III-V optoelectronic device design and manufacture, gained with Agilent Technologies. As a founding member of CST Global, he is responsible at Sivers Photonics for the technical roadmap of the company, including developing new device designs and process technologies.
Roshene McCool, Senior Market & Technology Development Manager, Corning Incorporated
Roshene is the Market and Technology Development Manager for Corning Optical Fiber and Cable, specialising in single mode fiber and access networks. She provides technical and market insight for Corning’s global fiber and cable product line management teams. Roshene has 30 years of experience in engineering and optical communications systems and subsystems, including many years designing networks for advanced radio telescopes. Roshene has held project management and coordination lead roles in diverse teams through her career. Roshene holds a Masters Degree in Electrical and Electronic Engineering from the University of Nottingham, United Kingdom and is a chartered member of the Institution of Engineering and Technology (IET).