Amphenol is advancing XPO (eXtra-dense Pluggable Optics), a breakthrough architecture delivering up to 4× higher front-panel density than OSFP and enabling 204.8Tbps of switching capacity within a single rack unit. By dramatically increasing bandwidth density, XPO allows large-scale AI networks to consolidate switching infrastructure into fewer racks while maintaining pluggability and serviceability. The module integrates liquid cooling directly within its design, supporting high-power operation in next-generation liquid-cooled racks. These capabilities enable scale-out AI architectures to reduce network footprint, lower overall power consumption, and simplify deployment while supporting the rapid growth of distributed AI workloads.

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