Next-generation optical systems face a critical wall: high insertion loss, limited drive efficiency, and bandwidth caps that stifle innovation. LIGENTEC’s Next-Generation Heterogeneous SiN-TFLN Photonic Platform addresses these limits by seamlessly integrating Silicon Nitride and Thin Film Lithium Niobate via dedicated runs.

By reducing modulator insertion loss, boosting voltage efficiency, and pushing bandwidths beyond 110 GHz, our platform transforms possibilities. Combined with low-power thermo-optic heaters and integrated InGaAs photodiodes for complete on-chip optical processing, our platform gives pioneers in telecom, LiDAR, quantum, and medical imaging the raw electro-optic performance needed to shape the future.

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