Teramount is introducing a Detachable fiber assembly solution for scalable silicon photonics packaging. Teramount’s patented PhotonicPlug technology offers a re-workable and detachable connectivity of a large number of fibers with an unprecedented ±30µm/0.5dB fiber assembly tolerances, post reflow assembly and full compatibility with co-packaged optics and electronics packaging. The PhotonicPlug technology utilizes wafer level manufacturing processes for accurate placement of optics and for aligning silicon photonics with standard semiconductor manufacturing and packaging flow.

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