The Detachable PhotonicPlug: Teramount’s Game Changing Fiber Assembly Solution for Co-Packaged Optics
13th September 2022
Teramount is introducing a Detachable fiber assembly solution for scalable silicon photonics packaging. Teramount’s patented PhotonicPlug technology offers a re-workable and detachable connectivity of a large number of fibers with an unprecedented ±30µm/0.5dB fiber assembly tolerances, post reflow assembly and full compatibility with co-packaged optics and electronics packaging. The PhotonicPlug technology utilizes wafer level manufacturing processes for accurate placement of optics and for aligning silicon photonics with standard semiconductor manufacturing and packaging flow.