LIGENTEC is introducing photonic integrated circuits (PICs), combining silicon nitride with thin-film lithium niobate to achieve fast modulation speeds in the GHz range. This innovative platform leverages the low-loss properties of silicon nitride (dB/m) with the high electro-optic modulation capabilities of lithium niobate (GHz), providing a best-of-both-worlds solution. The hybrid approach enables access to high-speed modulation for communication, quantum computing, and sensing. This offers customers enhanced speed, efficiency, and scalability for next-generation photonic devices.

Further Information