Spot size converter from Ligentec

Stand 601

11th September 2019

Today, the most efficient ways of communication for PICs with the “outside world” require UHNA or lensed fibers, which are non-standard, expensive and hard-to-handle. Moreover, they are very sensitive to alignment due to the small mode field diameter. Altogether, this leads to expensive and complicated packing procedures, hardly compatible with large-volumes.

To overcome this obstacle, LIGENTEC developed and patented a brand new “Ex-Spot” module – an optical I/O interface with large mode field diameter matching the one of SMF-28 fiber. It allows unprecedented coupling efficiency (<1dB) for thick film PICs with industry standard optical fibers and significantly decreases the price and efforts for packaging procedures.