With the automated die bonder FINEPLACER® femto blu, Finetech has announced a machine solution for cost-efficient photonics production offering a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low force bonding capability down to 0.05 N.

Designed for prototyping and high-yield production duties, the micro assembly cell supports all bonding technologies specifically required for the assembly of e.g. Silicon Photonics and photonic/ optoelectronic components in the field of data and telecommunications, high power lasers and other industrial semiconductors, as well as 3D sensors/ LiDAR for augmented reality, automotive applications and more.

Depending on the specific needs, the modular FINEPLACER® femto blu can be individually configured and upgraded in-field to support additional applications and technologies.

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