SABIC’s EXTEM™ RH1016UCL resin is a new ultra-high-heat, near-infrared (IR)-transparent thermoplastic. It is well-suited for lens arrays used in co-packaged optical transceivers as it can robustly withstand the 260°C peak temperature of printed circuit board (PCB) reflow soldering. This helps to avoid the separate assembly and alignment processes that are required for lower-temperature lens materials. The new EXTEM resin can provide high-throughput production using precision micro-molding. Together with the complex lens array designs that a thermoplastic enables, this new resin can help you transition from pluggable optics to co-packaged optics.