Recently SMART Photonics launched its next generation building blocks for the production of Photonics Integrated Circuits.
This platform (Gen 2) enables manufacturing of high-speed application products.
- Introduction of a Semi-Insulating Substrate- An improved electrical isolation between the components on the chip
- Beyond 25 GBaud and is ready to support further the ever-increasing demand for bandwidth
- Smarter ways to build Photonic Integrated Circuits
- Allowing the integration of a large number of lasers, amplifiers and passive components in a single circuit
- The platform demonstrated the capability to deliver widely tuneable lasers covering up to 75 nm and with narrow linewidths in the order of 100 kHz