Recently SMART Photonics launched its next generation building blocks for the production of Photonics Integrated Circuits.

This platform (Gen 2) enables manufacturing of high-speed application products.

Highlights:

• Introduction of a Semi-Insulating Substrate- An improved electrical isolation between the components on the chip
• Beyond 25 GBaud and is ready to support further the ever-increasing demand for bandwidth
• Smarter ways to build Photonic Integrated Circuits
• Allowing the integration of a large number of lasers, amplifiers and passive components in a single circuit
• The platform demonstrated the capability to deliver widely tuneable lasers covering up to 75 nm and with narrow linewidths in the order of 100 kHz

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