Silicon Photonics chips for quantum computing operate at a temperature of a few Kelvin. This makes the attachment of the necessary single mode fibers challenging. The typical epoxy gluing method does not create stable connections, especially when several cool-down cycles are needed.

Selective laser soldering provides much more robust connections which survive repetitive temperature cycling. The VersaSolder system offered by nanosystec is ideally suited to connect multiple optical fibers with this type of Silicon Photonics chip. Two optical heads focus the laser beams to the joining point and reflow the solder material. After the laser power is ramped down, the solder cools and forms a stable connection. The symmetric configuration with two simultaneous beams avoids shift during the assembly procedure.

Compared to epoxy gluing, the laser soldering method saves time as placing an optical fiber and soldering takes only a few seconds. Therefore, the laser soldering allows for much higher production volumes at the same time.

With its modular architecture, the VersaSolder system can be configured to the requirements of the specific process development and manufacturing process.

https://nanosystec.com/en/products/26-versasolder

Exhibition Reference: nanosystec will exhibit on ECOC show in Frankfurt (September 23 to 25, 2024).

About nanosystec
nanosystec designs and builds high-precision assembly and test stations. These use accurate motion control and joining techniques such as precision laser welding, laser soldering and micro gluing with UV curing. Precision cutting and fine balancing complete the portfolio. The systems are used worldwide in opto-electronics and medical applications, automotive industry and aerospace.
nanosystec GmbH
Marie-Curie-Straße 6
64823 Groß-Umstadt
Phone: +49 6078 782540
www.nanosystec.com
sales@nanosystec.com

August 7, 2024
For any editorial questions, please contact me directly: christiane.hummelt@nanosystec.com