Samtec Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solutions in data center applications. Electrically pluggable CPC/CPO connectivity is achievable on a 95 mm x 95 mm or smaller substrate. CPX offers the lowest loss signal transmission from the package to the front panel or backplane. Interchangeability between copper and optical interconnects simplifies system architectures and offers flexibility in scale-up/scale-out implementations. Field replaceable CPO solutions are a must for AI scale-up/scale-out as well.

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