SENKO’s Detachable Precision Alignment Device (PAD) system enhances optical connectivity for co-packaged optics and dense photonic systems by introducing a detachable, highly compatible design. It solves key challenges in manufacturing, testing, and lifecycle management, offering scalability and flexibility for Telecom, Data Centers, and HPC applications. PADs provide sub-micron alignment by interlocking precisely between the chip and the MPC or other fiber connectors, ensuring accurate fiber-to-chip communication. This precise alignment allows efficient signal transfer with minimal loss, eliminating the need for expensive active alignment processes, thus improving production efficiency and reducing overall costs.

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