Visit Corning at Booth 1156, Pavilion 1 for a first look at how AI is reshaping optical connectivity inside the rack. Our ECOC exhibit will show the contrast between today’s dense front-cabling reality and tomorrow’s optical backplane approach, bringing Scale Up challenges and solutions to life through physical demos. Attendees will see high-density cable management, optical blind-mate concepts, cable cartridge designs, and product demonstrations that highlight how Corning is helping enable simpler, more scalable AI infrastructure. Stop by to explore the technologies and system-level thinking shaping the next generation of high-density data center design.

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