Samtec’s FireBlade™ FireFly™ OCP OAI EXP Module provides 1.6 Tbps aggregate throughput. The module supports Data Center, HPC, and FPGA-to-FPGA protocols including Ethernet, InfiniBand™, Fibre Channel, PCI Express®, and CXL®. It typically requires half the power of MSA-style optics. Each OCP OAI Universal Baseboard (UBB) can accommodate up to eight FireBlade™ FireFly™ OCP OAI EXP Modules.

The FireBlade™ FireFly™ OCP OAI EXP Module also incorporates US Conec MMC optical connectors which provide 3x cabling port density over the MPO format helping achieve expanded fiber density in the EXP module form factor.

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