ECOC

Exhibition 21 - 23 September 2026

Conference 20 September - 24 September 2026

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Exhibitor News

Samtec Si-Fly® HD 224 Gbps PAM4 Co-Packaged & Near Chip Interconnect Systems

Stand C3530

11th June 2025

Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today’s market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec’s SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec’s SFCC cable assembly or an optical cable assembly of your choosing.

Further Information

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  • Avicena will showcase the world’s first 1Tbps evaluation kit at ECOC 2026

    Stand 1365

    9th September 2026

    Avicena, the pioneer in microLED-based optical interconnects, will showcase its 1 Tbps LightBundle™ evaluation kit at booth #1365 during ECOC 2026. The latest LightBundle eKit...

  • PIC Packaging for Harsh Environments

    Stand 1051

    9th September 2026

    PhotonFirst is a pioneering Dutch photonics company with over two decades of experience turning photonic innovation into reliable, deployable technology. We specialize in advanced PIC...

  • Take photonic chip characterization to the next level with ZEPREN’s OFDR system

    Stand 1344

    9th September 2026

    Designed for high-resolution analysis of integrated photonic structures, it enables detailed characterization of DBR cavities for laser applications, with a spatial resolution down to 2.5...

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