Ciposa has recently completed a proof of concept for 4K-MEMS., tackling the challenge of positioning and gluing a microlenses ~0,4 mm on top of a “broadband NIR/MIR emitter” chip ~ 1 mm with an accuracy of ±10 µm. The evaluation included vision recipe definition, feeder performance, component integrity, dispensing and curing processes, and high-precision assembly validation.

Tests performed on dedicated Ciposa equipment confirmed strong bonding and precise positioning, while also revealing feeder-related risks. This achievement demonstrates Ciposa’s expertise in advanced micro-assembly for photonics and opens the way for future developments.

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