PIC Packaging for Harsh Environments
Stand 1051
9th September 2026
PhotonFirst is a pioneering Dutch photonics company with over two decades of experience turning photonic innovation into reliable, deployable technology. We specialize in advanced PIC packaging for mission-critical applications, from aerospace and defense to offshore and quantum systems. Our platform-agnostic approach combines precision PIC packaging, fiber alignment and welding, die and wire bonding, testing, system integration and qualification. With state-of-the-art cleanroom facilities and proven experience in harsh environments, we take photonic technologies from first prototype to qualified, OEM-ready products. Our packages are engineered to perform where reliability matters most: under extreme temperature, vibration, shock, electromagnetic interference and radiation. Qualified. Deployed. Proven.

