At ECOC booth C1131, ASMPT showcases its comprehensive expertise in photonics manufacturing. A highlight is the new MEGA-P platform – a modular multi-chip bonding solution that combines multiple processes within a single system. It enables precise and efficient integration of complex assemblies for co-packaged optics and advanced sensor applications. Complementing the platform are the AMICRA NANO, offering ultra-high placement accuracy for prototyping and hybrid bonding, and the AMICRA NOVA Pro, designed for automated high-volume production. All three systems represent the highest standards in precision, process reliability, and flexibility – ideal for optical communication and next-generation AI infrastructure applications.

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