Characterization and testing of photonic integrated circuits (PICs) still presents one of the largest challenges for the industry, given the relatively low yields still found in photonic manufacturing and the large costs from packaging non-good dies. VLC Photonics can now support customers with both die and wafer level characterization and test services for PICs from all main material platforms: Si/SiN photonics, InP, PLC, etc., including optical probing (vertical and edge) and electrical measurements (DC and RF up to 110 GHz), at different wavelength ranges (visible and O to L bands). VLC can support also with design and layout review for test.

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