Chip Integration Technology Center (CITC) developed the unique Semiconductor Packaging University Program together with HAN University of Applied Sciences. The third edition, which kicks off on August 29, will cover, among other things, the various challenges in the assembly and packaging of PICs in a nutshell. Topics include light outward transmission, in/out plane couplers, fiber alignment accuracy and stability, and spot-size conversion. If you are interested in expanding or deepening your knowledge in the field of packaging and assembly, it is still possible to register for the program.

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