As photonic integrated circuits (PIC) move beyond data centres into demanding applications such as space, subsea infrastructure, defence, and industrial sensing, packaging becomes a critical factor in ensuring long-term performance and reliability.
Building on more than 20 years of experience in fibre optic sensing and harsh-environment photonics, Photonfirst now offers specialised PIC packaging services for challenging operating conditions. With one of the industry’s few flight-qualified PIC-based systems, Photonfirst combines expertise in manufacturing, packaging, qualification, and testing to help customers accelerate the deployment of robust photonic solutions in the most demanding environments.

Visit PhotonFirst at ECOC to discuss your PIC packaging challenges.

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