Photon Bridge and PHIX announced their partnership to advance Photon Bridge’s high-performance DWDM external laser source Transmit Optical Sub-Assembly (TOSA), targeting co-packaged optics (CPO) and high-density optical interconnects for AI data center infrastructure. This collaboration combines Photon Bridge’s photonic integration expertise with PHIX’s advanced packaging capabilities to accelerate volume production for CPOs and high-density interconnect applications.

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