PHIX is proud to announce the development of a new open architecture prototyping package for photonic integrated circuits (PICs), the 𝐏𝐇𝐈𝐗 𝐑𝐅 𝐂𝐡𝐚𝐫𝐚𝐜𝐭𝐞𝐫𝐢𝐳𝐚𝐭𝐢𝐨𝐧 𝐏𝐚𝐜𝐤𝐚𝐠𝐞. As the name suggests, this packaging solution supports 16 RF signals in a GSG configuration, alongside its 120 DC connections.
Based on off-the-shelf building blocks and standardized production processes, this packaging solution enables quick and affordable characterization of your first PICs or system integration tests of your RF optoelectronic modules. Besides highly standardized, it’s also very flexible, supporting PICs of different sizes and material platforms.

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