OIF has released new details on the four multi-vendor interoperability demonstrations it will bring to ECOC 2026, September 21–23 in Málaga, Spain. Featuring 39 OIF member companies, the live demonstrations at booth #2126 will span Optical Systems, Common Electrical I/O (CEI), Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI) and Co-Packaging. The newly announced details highlight technologies including 448G and 224G electrical interfaces, coherent optical systems, advanced module management, energy-efficient architectures, co-packaging and Near-Package Optics — showing how OIF members are turning collaborative specifications into interoperable implementations for AI-era networks.

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