Photonect has been awarded a $1.25 million NSF SBIR Phase II grant to advance its epoxy-free, laser fusion-based fiber-to-chip packaging technology. The company’s novel method—combining CO₂ laser fusion splicing with precision-engineered silicon dioxide mode converters—achieves <1.0 dB coupling loss while enabling permanent glass-to-glass bonds. With ±2.5 μm alignment tolerance and support for multi-channel fiber arrays, the solution is designed for automated, high-volume manufacturing. This funding will help the company scale their tech to transform photonic manufacturing with PIX-Attach™—our epoxy-free laser splicing machine, now open for waitlist sign-ups.

Further Information