Alter Technology UK have launched the Somerville packaging platform, a new foundry-compatible, high TRL, standard Photonic Integrated Circuit (PIC) packaging platform complete with Assembly Design Kit (ADK).

The platform offers an affordable solution to the manufacture of complex PICs. Available with hermetic configurations of 40 DC connections, 8 RF (GSG 30GHz), 32 optical channels through two 16-channel fibre arrays (grating and edge coupling).

A Luceda IPKISS ADK is available for Somerville, defining optical and electrical interconnects and enabling standard interposers and pre-programmed assembly processes for economical PIC packaging from prototype through to volume manufacture.

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