New Die Bonder Ideally Positioned for Photonics Market
8th October 2021
Palomar Technologies announced the availability of their new Palomar 3880-II Die Bonder. It is based on Palomar’s proven 3880 Die Bonder design but now includes options to even further maximize productivity, reduce programming time by up to 95% and improve the overall bonder productivity.
Users of the 3880-II can expect the same unparalleled flexibility in the 3880-II with support for eutectic, epoxy, solder paste, inspection, tracking, sorting, all in one machine that can continually scale up in automation and volume. It represents a solid investment for all customers from R&D up to volume, automated bonding.