Nanoscribe scales optical coupling for industrial photonic packaging
Stand 1410
9th September 2026
As photonic integrated circuits (PICs) move toward industrial production, packaging increasingly determines cost, throughput, yield, and scalability. But optical coupling remains a major bottleneck.
Nanoscribe addresses this challenge with a straightforward approach: instead of separately assembling and aligning discrete micro-optics, optical couplers are printed directly onto photonic components, such as PICs, optical fibers, lasers, and other photonic devices. Fiber cores, chip edges, fiducials, and surfaces features are automatically detected, enabling freeform micro-optics to be fabricated directly in their precisely aligned position.
This aligned 3D printing approach simplifies optical coupling, reduces assembly complexity, and streamlines photonic packaging processes for scalable production.

