MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Board (CoB) assemblies utilizing epoxy processes.

The MRSI-LEAP high-speed 1µm die bonder boasts a range of innovative features that make it an essential tool for ultra-high-volume manufacturing. It offers unparalleled efficiency with exceptional precision <±1µm @ 3σ ensuring long-term stability and high precision in true 24/7 die bonding applications to support ultra-high volume driven by AI.

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