ECOC

Exhibition 2-4 October 2023

Conference 1-5 October 2023

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Exhibitor News

MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

Stand 660

22nd July 2022

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022.

MRSI-H Family

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