MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging

Stand 703

26th September 2023

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform.

The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. It is the ideal tool for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging.

MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging