Molex Introduces First-to-Market Hybrid Optical-Electrical Interconnects for External Laser Source Co-Packaged Optics Applications
9th September 2022
Molex, a leading global electronics leader and connectivity innovator, has announced its first-to-market, pluggable module interconnect solution supporting co-packaged optics (CPO) implementations. Its new External Laser Source Interconnect System (ELSIS) is a complete system of cage, optical and electrical connectors with a pluggable module that uses proven technology to speed the development of hyperscale data centers.
ELSIS offers exceptional advantages as a comprehensive, all-in-one solution solving critical safety, thermal management and field replacement or upgrade challenges of highly demanding hyperscale data center I/O. External laser source systems comprise a complex mix of optical and electrical connectors, pluggable modules, internal host system fiber optic cabling and cages. By designing all these elements in-house, Molex has created a complete, fully engineered system that obviates the lengthy design cycles needed to integrate these components. The result is a highly interoperable, high-performance system that gives designers and end-users a plug-and-play experience.
All of this is possible thanks to Molex’s uniquely broad portfolio, which includes optical and electrical connectors, on-card optical cabling, optoelectrical modules and cage design. As the only company to bring these capabilities together in-house, Molex is leading the industry in the transition to CPO.
Visit Molex Booth # 127 at ECOC 2022 to see samples of the blind-mating hybrid optical-electrical connector on display and learn more about this new, industry-leading solution.