Axetris’ products in silicon and fused silica have excellent properties for optical communication solutions and applications from the UV to the IR spectrum. With lens dimensions as small as a few hundred microns and chip thicknesses down to 100 µm, our products enable compact packaging and miniaturized optical setups in line with individual customer requirements. Our scalable wafer-level processes ensure consistent and reliable output quality, which is a key success factor for performance-critical applications.

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