As AI infrastructure pushes power densities ever higher, liquid cooling is expanding beyond processors and into optical networks. Next-generation OSFP modules and emerging architectures such as XPO are driving the need for more efficient thermal management, improved reliability, and higher system performance.
Stäubli supports every connection in the liquid cooling loop, from optical modules to networking equipment, with a complete portfolio including the new Mini QD, as well as MQD and UQD quick disconnect solutions. Meet our experts at ECOC 2026 (Booth 1330) and discover how fluid connectivity is enabling the future of liquid-cooled optics.

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