LIPAC’s ‘Optical System in Package’

Stand 511 & 601

13th September 2022

LIPAC is doing with laser-added semiconductor business. By adopting semiconductor technology, FOWLP (Fan-Out Wafer Level Packaging), we integrate two different types of
IC such as electronic and photonic as an ‘Optical System in Package’, which gives us many benefits for versatile applications. It also can be extended to any combination of IC for a
new application by optimizing design and process on requests. we have 2 types of products such as transceiver and senor. Our O-SIP-based single and multi-mode transceiver have
many advantages comparing to Chip on Board and O-SIP-based TOF sensor also shows more competitive edge to conventional one.

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