From millimeters to kilometers, the future of AI/ML interconnects demands seamless performance across every scale. As models grow larger and data pipelines expand, the limits of traditional electrical links become clear—latency, power, and bandwidth bottlenecks slow progress. Optical interconnects provide the scalability needed for rack-to-rack and datacenter-to-datacenter connections, while high-density electrical links still excel inside servers and accelerators. Co-packaged copper, tightly integrated with silicon, is key to sustaining data rates beyond 224Gbps while preserving a clear migration path to co-packaged optical solutions—making deployments both future-proof and cost-effective. Unified interconnects empower organizations to scale AI/ML efficiently, accelerating insights at any distance.

Discover More