Scaling ferroelectric films for industrial applications requires overcoming challenges related to cost, throughput, and production volume. FFLOWS addresses these challenges with an innovative chemical solution-based process for fabricating optical grade ferroelectric films for photonic integrated circuits, including Pb(Zr,Ti)O₃ and BaTiO₃, at wafer scale. Currently, wafers up to 100 mm are available, with 200 mm wafers expected by spring 2026. The FFLOWS process offers a low-cost, high-throughput, and highly scalable approach, allowing for the facile integration of ferroelectric films into CMOS process flows.

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