ICON Photonics developed a wafer-level integrated packaging platform combining a Silicon optical bench (1) and a unique low-loss technology based on proprietary 3D polymer micro-optics (2). This platform is ideal to create custom and reliable optical micro-benches, integrating fiber array coupling and maintaining systems (3), as well as high-speed electrical interconnects.
All the solutions are compatible from cryogenic to high-temperature environments, opening a new era especially for optical communications and quantum applications. ICON proposes a one-stop-shop collaboration model going from design and package development to high volume wafer-scale manufacturing services.

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