Hyper Photonix will exhibit at ECOC 2026 its full family of SIP transceivers, covering 400G, 800G, and 1.6T DSP, LPO and LRO in multiple form factors.

Opening its new Hangzhou facility in June 2026, the company’s global manufacturing capacity now exceeds 500,000 units/month. A new facility outside China will come online in 2026 early 2027, positioning the company to meet the surging demand in AI data center deployment. Visit us at the booth 1266 to meet our team and discuss our future roadmap – including next-generation 3.2T and beyond.

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