Meet Finetech at ECOC 2026. On Wednesday, 23 September, Sales Manager Sylvain Dulphy gives a talk at the EPIC TechWatch (11:45 to 12:00): From Lab to Volume: What Advanced Packaging Actually Requires. As advanced photonics like co-packaged optics and silicon photonics move from demonstrator to production, the real question is whether a proven assembly process holds up at volume. As the leading manufacturer of sub-micron die bonding and assembly equipment, Finetech delivers solutions that grow with your needs: the high-accuracy, flexible FINEPLACER® femto 2 for advanced packaging, bridging R&D and automated production, and the FiNEXT P3 die bonder for automatic 12-inch wafer handling and series production.

Come find us at booth #1418 and talk process before you scale.

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