As the industry accelerates toward 448G, interconnect performance is becoming a critical system bottleneck. In this article, MultiLane demonstrates how intelligent signal integrity design can push standard PCB technology to achieve 120 GHz performance, without relying on costly ultra-low-loss materials.

By combining advanced RF design techniques with the high-density SMPX interconnect ecosystem and precision 1.00 mm connectors, MultiLane enables scalable, cost-effective solutions for next-generation test and measurement, semiconductor validation, and high-speed system development. The result is a practical path to 448G that balances performance, manufacturability, and deployment readiness.

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