Combined Electro-optical Wafer-level Testing
7th September 2021
ficonTEC’s new Wafer-level Test (WLT) product line is specially designed as a versatile, fully automated test-&-measurement system platform for on-wafer device test, for example, of waveguides, PICs and hybrid opto-electronic devices. They also routinely undertake complex electro-optical testing of singulated PIC and chip devices, either passively tested or actively driven, and the probe set-up can be flexibly configured to suit different contact/port layouts. The system is driven by ficonTEC’s PCM software, meaning machine vision recognition for contact pads and I/O ports, and OCR for device tracking. Fast, high-precision alignment to multiple optical ports ensures rapid, hands-off testing across entire wafers.